Special Issue Title: Advanced MEMS and Optical System Assembly and Integration

客座编辑：
Prof. Dr. Jianping Chen
Dr. Di Sun
Dr. Yu Jin


征稿范围：
The research and development of advanced MEMS and optical systems has attracted attention from both academia and industry. They are tremendously valuable for enabling new applications including augmented reality/mixed reliability (AR/MR), autonomous driving systems (ADS), unmanned aerial vehicles (UAV), optical image stabilization (OIS) and robotic vision. The whole system requires the integration of multiple components, such as MEMS scanning mirrors, laser diodes, micro-LED arrays, waveguides, image sensors, and time-of-flight (ToF) sensors. There is a strong need to develop advanced assembly and packaging processes for the individual component or large component arrays. Meanwhile, new ideas of system-level co-design and optical mechanical architecture are necessary to improve performance, miniaturization, yield, and reliability. In this Special Issue, we would like to invite you to contribute research papers, communications, and review articles related to advanced MEMS and optical system assembly and integration architectures, designs, processes, testing approaches and simulations. Topics of interest for publication include but are not limited to:

Micro-led array assembly
Self-assembly/fluidic assembly
Pick and place
Flip-chip bonding
Adhesives/ACF
3D assembly
TSV, hybrid bond
Multi-chip module/chiplet
Optomechanical alignment
Encapsulation
Reliability
Simulation




特刊详情页链接：https://www.mdpi.com/journal/mic ... ssembly_integration

截止日期：2021.10.10

联系邮箱：micromachines@mdpi.com

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