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SCI期刊Micromachines (IF:2.523) 专刊征稿
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Special Issue Title: Advanced MEMS and Optical System Assembly and Integration 客座编辑： Prof. Dr. Jianping Chen Dr. Di Sun Dr. Yu Jin 征稿范围： The research and development of advanced MEMS and optical systems has attracted attention from both academia and industry. They are tremendously valuable for enabling new applications including augmented reality/mixed reliability (AR/MR), autonomous driving systems (ADS), unmanned aerial vehicles (UAV), optical image stabilization (OIS) and robotic vision. The whole system requires the integration of multiple components, such as MEMS scanning mirrors, laser diodes, micro-LED arrays, waveguides, image sensors, and time-of-flight (ToF) sensors. There is a strong need to develop advanced assembly and packaging processes for the individual component or large component arrays. Meanwhile, new ideas of system-level co-design and optical mechanical architecture are necessary to improve performance, miniaturization, yield, and reliability. In this Special Issue, we would like to invite you to contribute research papers, communications, and review articles related to advanced MEMS and optical system assembly and integration architectures, designs, processes, testing approaches and simulations. Topics of interest for publication include but are not limited to: Micro-led array assembly Self-assembly/fluidic assembly Pick and place Flip-chip bonding Adhesives/ACF 3D assembly TSV, hybrid bond Multi-chip module/chiplet Optomechanical alignment Encapsulation Reliability Simulation 特刊详情页链接：https://www.mdpi.com/journal/mic ... ssembly_integration 截止日期：2021.10.10 联系邮箱：micromachines@mdpi.com 欢迎同学老师们积极投稿！ 谢谢各位专家、老师、同学的大力支持！ |
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tzynew2楼
2021-05-13 08:00
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helloyxp(金币+1): 谢谢参与
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bjdxyxy3楼
2021-05-13 08:06
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helloyxp(金币+1): 谢谢参与
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2021-05-13 08:28
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helloyxp(金币+1): 谢谢参与
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2021-05-13 08:32
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helloyxp(金币+1): 谢谢参与
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helloyxp(金币+1): 谢谢参与
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