±±¾©Ê¯ÓÍ»¯¹¤Ñ§Ôº2026ÄêÑо¿ÉúÕÐÉú½ÓÊÕµ÷¼Á¹«¸æ
²é¿´: 1803  |  »Ø¸´: 5

helloyxp

Ìú³æ (³õÈëÎÄ̳)


[½»Á÷] SCIÆÚ¿¯Micromachines (IF:2.523) ר¿¯Õ÷¸å

Special Issue Title: Advanced MEMS and Optical System Assembly and Integration

¿Í×ù±à¼­£º
Prof. Dr. Jianping Chen
Dr. Di Sun
Dr. Yu Jin


Õ÷¸å·¶Î§£º
The research and development of advanced MEMS and optical systems has attracted attention from both academia and industry. They are tremendously valuable for enabling new applications including augmented reality/mixed reliability (AR/MR), autonomous driving systems (ADS), unmanned aerial vehicles (UAV), optical image stabilization (OIS) and robotic vision. The whole system requires the integration of multiple components, such as MEMS scanning mirrors, laser diodes, micro-LED arrays, waveguides, image sensors, and time-of-flight (ToF) sensors. There is a strong need to develop advanced assembly and packaging processes for the individual component or large component arrays. Meanwhile, new ideas of system-level co-design and optical mechanical architecture are necessary to improve performance, miniaturization, yield, and reliability. In this Special Issue, we would like to invite you to contribute research papers, communications, and review articles related to advanced MEMS and optical system assembly and integration architectures, designs, processes, testing approaches and simulations. Topics of interest for publication include but are not limited to:

Micro-led array assembly
Self-assembly/fluidic assembly
Pick and place
Flip-chip bonding
Adhesives/ACF
3D assembly
TSV, hybrid bond
Multi-chip module/chiplet
Optomechanical alignment
Encapsulation
Reliability
Simulation




ÌØ¿¯ÏêÇéÒ³Á´½Ó£ºhttps://www.mdpi.com/journal/mic ... ssembly_integration

½ØÖ¹ÈÕÆÚ£º2021.10.10

ÁªÏµÓÊÏ䣺micromachines@mdpi.com

»¶Ó­Í¬Ñ§ÀÏʦÃÇ»ý¼«Í¶¸å£¡

лл¸÷λר¼Ò¡¢ÀÏʦ¡¢Í¬Ñ§µÄ´óÁ¦Ö§³Ö£¡
»Ø¸´´ËÂ¥

» ²ÂÄãϲ»¶

» ÇÀ½ð±ÒÀ²£¡»ØÌû¾Í¿ÉÒԵõ½:

²é¿´È«²¿É¢½ðÌù

ÒÑÔÄ   »Ø¸´´ËÂ¥   ¹Ø×¢TA ¸øTA·¢ÏûÏ¢ ËÍTAºì»¨ TAµÄ»ØÌû
¼òµ¥»Ø¸´
tzynew2Â¥
2021-05-13 08:00   »Ø¸´  
helloyxp(½ð±Ò+1): лл²ÎÓë
ii ·¢×ÔСľ³æAndroid¿Í»§¶Ë
bjdxyxy3Â¥
2021-05-13 08:06   »Ø¸´  
helloyxp(½ð±Ò+1): лл²ÎÓë
¡£ ·¢×ÔСľ³æAndroid¿Í»§¶Ë
2021-05-13 08:28   »Ø¸´  
helloyxp(½ð±Ò+1): лл²ÎÓë
¡£ ·¢×ÔСľ³æIOS¿Í»§¶Ë
2021-05-13 08:32   »Ø¸´  
helloyxp(½ð±Ò+1): лл²ÎÓë
¡£ ·¢×ÔСľ³æAndroid¿Í»§¶Ë
yuyu984126Â¥
2021-05-13 08:43   »Ø¸´  
helloyxp(½ð±Ò+1): лл²ÎÓë
¡£ ·¢×ÔСľ³æAndroid¿Í»§¶Ë
Ïà¹Ø°æ¿éÌø×ª ÎÒÒª¶©ÔÄÂ¥Ö÷ helloyxp µÄÖ÷Ìâ¸üÐÂ
×î¾ßÈËÆøÈÈÌûÍÆ¼ö [²é¿´È«²¿] ×÷Õß »Ø/¿´ ×îºó·¢±í
[¿¼ÑÐ] 294Çóµ÷¼Á +3 Grey_Ey 2026-04-03 3/150 2026-04-03 19:31 by СÖÇÁúÁú
[¿¼ÑÐ] ²ÄÁϵ÷¼Á +5 Ò»ÑùYWY 2026-04-03 5/250 2026-04-03 13:29 by baoball
[¿¼ÑÐ] Çóµ÷¼Á +3 êɹ¦? 2026-04-03 3/150 2026-04-03 11:52 by wxiongid
[¿¼ÑÐ] 306·Ö²ÄÁÏÓ뻯¹¤Çóµ÷¼Á +4 Àè°ÉÀ²À²ÄãºÜÓÐà 2026-04-03 4/200 2026-04-03 11:24 by wangjy2002
[¿¼ÑÐ] ±§Ç¸ +5 ÌïºéÓÐ 2026-03-30 5/250 2026-04-03 10:24 by linyelide
[¿¼ÑÐ] 309·Ö085801Çóµ÷¼Á +10 ѧԱGtwj7W 2026-03-31 10/500 2026-04-02 22:42 by yunlongyang
[¿¼ÑÐ] 085600µ÷¼Á +3 1amJJ 2026-04-02 3/150 2026-04-02 22:00 by ¿ÆÑÐСר¼Ò
[¿¼ÑÐ] Ò»Ö¾Ô¸Î人Àí¹¤0856£¬³õÊÔ334 +3 26¿¼ÑвÄÁÏ 2026-04-02 3/150 2026-04-02 21:22 by dongzh2009
[¿¼ÑÐ] ¡£ +4 ÎíÓ뺣 2026-04-02 5/250 2026-04-02 19:16 by ÍÁľ˶ʿÕÐÉú
[¿¼ÑÐ] Çóµ÷¼Á +7 Aniyaio 2026-04-02 7/350 2026-04-02 16:42 by zzsw+
[¿¼ÑÐ] 283Çóµ÷¼Á +3 jiouuu 2026-04-02 4/200 2026-04-02 14:08 by ßÕßÕßÕßÉßÉßÉ
[¿¼ÑÐ] 327Çóµ÷¼Á +9 ¼³Òàê» 2026-03-29 9/450 2026-04-02 11:44 by ÔËÆøyunqi
[¿¼ÑÐ] 324Çóµ÷¼Á +5 ÏëÉÏѧÇóµ÷ 2026-04-01 6/300 2026-04-02 10:16 by sanrepian
[¿¼ÑÐ] 372Çóµ÷¼Á +3 jjÓ¿77 2026-04-02 3/150 2026-04-02 09:57 by olim
[¿¼ÑÐ] 279Çóµ÷¼Á +7 Īxiao 2026-04-01 7/350 2026-04-01 22:05 by ¿Í¶ûÃÀµÂ
[¿¼ÑÐ] 310·ÖÇóµ÷¼Á +4 ³É¹¦Éϰ¶wang 2026-04-01 4/200 2026-04-01 20:35 by liu823948201
[¿¼ÑÐ] 375Çóµ÷¼Á +7 ÓêÏÄÕûÒ¹ 2026-03-29 7/350 2026-03-31 18:52 by xhai2011
[¿¼ÑÐ] 083000»·¾³¿ÆÑ§Ó빤³Ìµ÷¼Á£¬×Ü·Ö281 +4 ³È×Ó£¨Ê¤Ò⣩ 2026-03-30 4/200 2026-03-31 00:44 by Linzejun
[¿¼ÑÐ] Ò»Ö¾Ô¸»ªÖÐʦ·¶»¯Ñ§332·ÖÇóµ÷¼Á +3 Lyy930824@ 2026-03-29 3/150 2026-03-30 20:15 by DHUSHUAI
[¿¼ÑÐ] 356Çóµ÷¼Á +4 gysy?s?a 2026-03-28 4/200 2026-03-29 10:32 by ÌÆãå¶ù
ÐÅÏ¢Ìáʾ
ÇëÌî´¦ÀíÒâ¼û