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https://www.lboro.ac.uk/departme ... /changqing-liu.html
Professor of Electronics Manufacture
C.Liu@lboro.ac.uk


Research Associate – Development of Novel Functional Intermediate Layers for Power Electronics Integration
Job Ref: REQ180075
As part of the University’s ongoing commitment to redeployment, please note that this vacancy may be withdrawn at any stage of the recruitment process if a suitable redeployee is identified.
Project Description The research group relevant to the advertised post consists of researchers involved with a significant number of current government and industrially funded hybrid electronics research projects. Loughborough University has outstanding research expertise and relevant facilities for electronics manufacturing research including advanced materials deposition, bonding/ joining and associated materials characterisation and testing based at Loughborough Materials Characterisation Centre (LMCC).
This is an exciting opportunity for researchers to join a strong group investigating and developing interlayer technologies in materials and processing for hybrid power electronics integration. The work will be funded through 2nd trench of funding of EPSRC Centre for Power Electronics underpinning power electronics in collaboration with Nottingham University, with an explicit aim to enable a leap forward for future generation design and manufacture of hybrid power modules through multi-materials and multi-functional heterogeneous integration.
The Research Associates will be primarily based in the Wolfson School of Mechanical, Electrical and Manufacturing Engineering, with certain laboratory work conducted elsewhere at the University and at collaborating organisations.
The work entails, primarily, the following activities under the direction and supervision of Professor Changqing Liu, Dr Zhaoxia Zhou or their nominee.
Job Description
Job Grade: Specialist and Supporting Academic Grade 6
Job Purpose:
Power electronics are widely used in electric and hybrid vehicles (EHV), aerospace crafts, renewable power components and traction control systems. At present, the rapid development in construction of power modules which is somewhat restricted by high switching frequency, high reliability and low loss requires heterogeneous integration. The uses of Wide Band Gap (WBG) such as SiC devices are also limited by the packaging technologies. This demands a cost effective route of implementing the necessary 3D structures needed to contain the EMI, address the thermal management and offer a more robust and reliable packaging solution. This project will focus on the packaging and integration technologies through the use of functional intermediate layers to enhance electrical, thermal and mechanical performance enabling a timely need to make a leap forward for the future use of these devices. This will be achieved by the development of different functional inter-layers and heterogeneous integration to enable robust multi-material, multi-functional embedded structures. Numerical modelling as well as materials characterisation techniques will be utilised to qualify the functionalised surfaces as well as the resultant interfaces in the course of interaction and evolution of the integrated structures. The Research Associates will be responsible for conducting research into the development of novel functional intermediate layers for heterogeneous power electronics integration.

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