题目：Effect of calcium fluoride on the grinding performance of diamond grinding wheel for silicon wafer manufacturing
摘要：Silicon wafers are the fundamental building blocks for most integrated circuits. It has been demonstrated that resin-bond diamond wheel could manufacture flat silicon wafers to meet the stringent specifications for silicon wafers at a lower cost. This paper addresses the grinding performance of silicon wafer by the calcium fluoride moulded resin bond diamond wheel. The results indicate that calcium fluoride could be used as a solid lubricant to significantly reduce the spider current and wheel wear in grinding process. The surface quality of silicon wafer ground by calcium fluoride moulded diamond wheel could be increased due to the increase of calcium fluoride. Meanwhile, the surface damage thickness becomes smaller due to the calcium fluoride. This provides practical guidance to manufacture the resin bond diamond wheel for future silicon wafer grinding.



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