Mordechay Schlesinger, PhD (Editor), Milan Paunovic, PhD (Editor)
ISBN: 978-0-471-16824-9
Hardcover
888 pages
August 2000
A new collection of authoritative contributions on the state of the art of electrochemical deposition
Since the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting-edge topics, from electrodeposition of semiconductors to environmental considerations.
Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up-to-date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next-generation technologies such as copper interconnect. Coverage includes:
* Electrodeposition of various metals and metal alloys
* Electrodeposition of semiconductors and electrodeposition on nonconductors
* Electrodeposition of conductive polymers
* Electroless deposition of various metals and alloys
* Preparation procedures for deposition
* Manufacturing technologies, monitoring, testing, and control
* Deposition and the environment
【书名】: 电镀工工艺手册
【作者】:曾华梁吴仲达
【推荐理由】:我们实验室做电镀的参考最多的就是这本书,挺老但是很经典,上面的配方也比较真实实用.下面是网上对这本书的介绍和评价:
本手册全面阐述了电镀工艺必备的各方面知识,内容涵盖了电镀基本知识、镀前表面处理、电镀常用设备、电镀工艺、金属的氧化、磷化与着色、特种电镀及常用镀液分析镀层、镀液性能测定学,其中电泳涂装、热浸镀、非水溶液电镀等均为最新的有很强实用价值的技术,从原理、工艺及设备系统地介绍了各种电镀工艺方法的选择及实施应用,并列以附录提供常用数据以供查阅,使本手册基本能反映目前我国电镀与精饰技术和工艺发展现状。
全书内容取材丰富、覆盖面广、实用性强、技术先进、条理清晰,便于查阅,很适合从事电镀与精饰的工程技术人员使用,也可供有关科研人员和大专院校师生参考。
推荐两本英文的电镀书,很经典的,我老板曾经特别推荐
希望大家能一起合作求地电子书
【书名】:Electroplating, Anodizing & Metal Treatment Hand Book
【作者】:NIIR Board
Format: Paperback
ISBN: 8178330652
Code: NI63
Pages: 708
Price: Rs. 975.00 US$ 100.00
Published: 2003
Publisher: National Institute of Industrial Research
连接
http://www.niir.org/books/book/zb,,3f_a_1f_0_3e8/Electroplating,+Anodizing+&+Metal+Treatment+Hand+Book/index.html
Modern Electroplating
Mordechay Schlesinger, PhD (Editor), Milan Paunovic, PhD (Editor)
ISBN: 978-0-471-16824-9
Hardcover
888 pages
August 2000
A new collection of authoritative contributions on the state of the art of electrochemical deposition
Since the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting-edge topics, from electrodeposition of semiconductors to environmental considerations.
Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up-to-date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next-generation technologies such as copper interconnect. Coverage includes:
* Electrodeposition of various metals and metal alloys
* Electrodeposition of semiconductors and electrodeposition on nonconductors
* Electrodeposition of conductive polymers
* Electroless deposition of various metals and alloys
* Preparation procedures for deposition
* Manufacturing technologies, monitoring, testing, and control
* Deposition and the environment
http://as.wiley.com/WileyCDA/WileyTitle/productCd-0471168246.html,
求以上两本书的电子版
理由 : 很好很全面
理由 : 很好很全面
看来做电镀的不是很多,所以没人支持呵呵
安茂忠,哈尔滨工大的,那书很好