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Moreover, in a real device situation, the graphene layer has to be stuck with some additional material (e.g. epoxy) to the Cu slug and the plate. The use of this material will introduce and extra thermal boundary resistance (apart from modifying the thermal conductivity of graphene, see next comment). It seems to this reviewer that the authors’ have not considered this, which makes their model not representative of a real device.
实际器件情况下，石墨烯层需要粘结在额外的材料上，如环氧树脂连接Cu和基板。这些材料将引入和导致额外的边界热阻（改变石墨烯热导率）。评审者认为作者没有考虑这些，这将使作者的模型不能代表实际模型。

在实际情况下，我的确没有考虑这些因素。请问大侠我改如何回头评审者呢？谢谢！

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