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1. 1st step---metallization on AlN ceramic substrate.
    You can have Cu sheets or plates dir bonded on AlN susbstra by
    DBC (direct bond copper) or AMB(active metal brazing) process.
2. 2nd step----SiC chip bonded on the metallized AlN substrate.
    SiC chip is able to joined on the Cu sheet through wire  
    bonding or soldering  process with active-metal containing   
    filler material.  .
Nosbig
5Â¥2016-03-10 17:15:18
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guoj5292

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2Â¥2016-03-08 19:57:22
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yinianyici

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2Â¥: Originally posted by guoj5292 at 2016-03-08 19:57:22
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3Â¥2016-03-08 21:07:30
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yinianyici

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2Â¥: Originally posted by guoj5292 at 2016-03-08 19:57:22
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