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Ñо¿·½Ïò£ºMEMS£¨microelectro-mechanical systems£© Éó¸åÒâ¼û£ºÈçÏÂËùÁÐ ¸öÈ˸ÐÏ룺µÚ¶þ¸öreviewer¿´ËÆÓеãΪÄÑÎÒÃÇ£¬ÌáÁ˺ܶà±È½ÏµóÄÑÈ˵ÄÎÊÌ⣬µ«ÊÇÕæµÄºÜÓаïÖú£¬ÓÈÆäÊǶÔÓÚÈçºÎÔÚÒѾÓÐÁ˺õÄideaµÄÇé¿öÏ£¬Ôõôʰ빦±¶Ö¤Ã÷Õâ¸öideaƯÁÁ¡£ºóÀ´ÎÒÃǻظ´Ö®ºó£¬Õâ¸öreviewer»¹ÓÖÀ´ÁËÒ»¸öÎÊÌ⣬ËùÒÔ»¹Óеڶþ´Î´ð¸´¡£×îÖÕreviewer¿ÉÄܱȽÏÂúÒâ°É£¬¸øÎÒÃÇÎÄÕ´ò·Ö±È½Ï¸ß£¬×îºó±»ÊÕµ½ÁËÔÓÖ¾µÄÄê¶ÈhighlightÀïÃæ£¨ÏÔ°Úһϣ¬Ö»ÓÐ3%µÄÎÄÕ±»ÊÕ¼ÁË £©Referee report First referee's report The concept is very interesting. The manuscript is very well written. The conclusions are supported by experimental data. Of course a good job! Second referee's report This work presents a new exciting idea to develop a XXX which has good potential. Authors have however failed to demonstrate clearly the benefits of their device. In Figure 7 the slope of the straight heated and XXX heated curve look very similar except for probably initial 2-3 secs. The two cooling mechanisms look to saturate at two different temperatures. It means that the thermal resistances of the two systems are different and are hence not completely comparable. The absolute difference in final temperature is of little consequence as a different heat-sink for the straight cooled device can reach the similar final temperature with a similar time delay. The benefit of the presented device is that it will allow any MEMS device to reach its final operating temperature quickly with minimal energy loss and then maintain the operating temperature. So it is recommended that the authors comment of the initial slope of the two curves (or compare the energy lost in reaching the final state) and compare their device with respect to the straight cooled device. Authors can also consider devicing an experiment in which both the systems reach the similar final temperature and demonstrate the benefit of the XXX. Authors are also recommended to discuss the temperature jump in initial 2-3 seconds for the no heatsink and the XXX case. The authors have presented a very good overview of the existing technology. The applicability of this technology, however, depends on availability of different XXXX. Authors are recommended to present a few exemplary XXXX¡¯s to show that this technology can be tuned for different applications requiring different turn on temperatures. The authors are requested to present a labeled cross section schematic of the displacement experiment i.e. figure 2 a. 5 mm droplet is sometimes too large for many MEMS applications. Also to achieve a better local thermal control the authors would like to design the heating array with as small a droplet as possible. Therefore the authors are recommended to discuss the effect of droplet miniaturization on the maximum displacement that can be achieved reversibly while considering the increasing effect of surface tension. The device schematic as shown has XXXX domes trapped in holes on copper plate. It is stated that the XXXX wets copper in its molten state. Then during operation of the device when the XXXX is in liquid phase how do the authors prevent the droplets to spread and wet the whole copper surface? Even if the wetting is slow, it will affect the long term operation of the device. |
50Â¥2012-12-01 10:18:11
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2Â¥2012-11-29 16:42:12
zhtear99
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3Â¥2012-11-29 16:47:48
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4Â¥2012-11-29 16:55:23















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