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Accession number:


20124215568026






Title:

Electroless Ni-B alloy plating from DMF at room temperature






Authors:

Wang, Jianchao1 ; Wang, Shuhai1 ; Ye, Guang1 ; Zhai, Bo1





Author affiliation:

1Department of Chemistry, Qinghai Normal University, Qinghai 810008, China






Corresponding author:

Wang, J. (wangjc@qhnu.edu.cn)






Source title:

Advanced Materials Research






Abbreviated source title:

Adv. Mater. Res.






Volume:

557-559






Monograph title:

Advanced Materials and Processes II






Issue date:

2012






Publication year:

2012






Pages:

1772-1776






Language:

English






ISSN:

10226680






ISBN-13:

9783037854570






Document type:

Conference article (CA)






Conference name:

2nd International Conference on Chemical Engineering and Advanced Materials, CEAM 2012






Conference date:

July 13, 2012 - July 15, 2012






Conference location:

Guangzhou, China






Conference code:

92757






Publisher:

Trans Tech Publications, P.O. Box 1254, Clausthal-Zellerfeld, D-38670, Germany






Abstract:

A new basic solution for eletroless Ni-B alloy plating from DMF was studied. The effects of composition and operating conditions on the rate of deposition of Ni-B alloy have also been discussed. The alloy component was analyzed by EDS and Inductively Coupled Plasma (ICP). The plating rate is determined by electronic balance. And structures of the plating coatings were investigated by means of scanning electron microscopy (SEM) and X-ray diffraction (XRD). The optimum composition and operating conditions for abstaining satisfied Ni-B alloy coating are provided. © (2012) Trans Tech Publications, Switzerland.






Number of references:

17






Main heading:

Alloys






Controlled terms:

Coatings  -  Electroless plating  -  Inductively coupled plasma  -  Metal cladding  -  Scanning electron microscopy  -  X ray diffraction






Uncontrolled terms:

Alloy coatings  -  Alloy components  -  Alloy plating  -  Basic solutions  -  DMF  -  Electroless  -  Electronic balances  -  Operating condition  -  Optimum composition  -  Plating rates  -  Rate of deposition  -  Room temperature






Classification code:

932.3 Plasma Physics -  931.3 Atomic and Molecular Physics -  741.1 Light/Optics -  539.3.2 Electroless Plating -  539 Metals Corrosion and Protection; Metal Plating -  538.2 Welding -  531.1 Metallurgy





DOI:

10.4028/www.scientific.net/AMR.557-559.1772






Database:

Compendex
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