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Accession number: 20124215568026 Title: Electroless Ni-B alloy plating from DMF at room temperature Authors: Wang, Jianchao1 ; Wang, Shuhai1 ; Ye, Guang1 ; Zhai, Bo1 Author affiliation: 1Department of Chemistry, Qinghai Normal University, Qinghai 810008, China Corresponding author: Wang, J. (wangjc@qhnu.edu.cn) Source title: Advanced Materials Research Abbreviated source title: Adv. Mater. Res. Volume: 557-559 Monograph title: Advanced Materials and Processes II Issue date: 2012 Publication year: 2012 Pages: 1772-1776 Language: English ISSN: 10226680 ISBN-13: 9783037854570 Document type: Conference article (CA) Conference name: 2nd International Conference on Chemical Engineering and Advanced Materials, CEAM 2012 Conference date: July 13, 2012 - July 15, 2012 Conference location: Guangzhou, China Conference code: 92757 Publisher: Trans Tech Publications, P.O. Box 1254, Clausthal-Zellerfeld, D-38670, Germany Abstract: A new basic solution for eletroless Ni-B alloy plating from DMF was studied. The effects of composition and operating conditions on the rate of deposition of Ni-B alloy have also been discussed. The alloy component was analyzed by EDS and Inductively Coupled Plasma (ICP). The plating rate is determined by electronic balance. And structures of the plating coatings were investigated by means of scanning electron microscopy (SEM) and X-ray diffraction (XRD). The optimum composition and operating conditions for abstaining satisfied Ni-B alloy coating are provided. © (2012) Trans Tech Publications, Switzerland. Number of references: 17 Main heading: Alloys Controlled terms: Coatings - Electroless plating - Inductively coupled plasma - Metal cladding - Scanning electron microscopy - X ray diffraction Uncontrolled terms: Alloy coatings - Alloy components - Alloy plating - Basic solutions - DMF - Electroless - Electronic balances - Operating condition - Optimum composition - Plating rates - Rate of deposition - Room temperature Classification code: 932.3 Plasma Physics - 931.3 Atomic and Molecular Physics - 741.1 Light/Optics - 539.3.2 Electroless Plating - 539 Metals Corrosion and Protection; Metal Plating - 538.2 Welding - 531.1 Metallurgy DOI: 10.4028/www.scientific.net/AMR.557-559.1772 Database: Compendex |
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baiyuefei
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3Â¥2013-11-14 11:09:57













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