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【答案】应助回帖
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gruyclewee: 金币+3, 感谢应助，奖励一下。 2013-11-14 11:15:51
Accession number:
20124215568026
Title:
Electroless Ni-B alloy plating from DMF at room temperature
Authors:
Wang, Jianchao1 ; Wang, Shuhai1 ; Ye, Guang1 ; Zhai, Bo1
Author affiliation:
1Department of Chemistry, Qinghai Normal University, Qinghai 810008, China
Corresponding author:
Wang, J. (wangjc@qhnu.edu.cn)
Source title:
Advanced Materials Research
Abbreviated source title:
Adv. Mater. Res.
Volume:
557-559
Monograph title:
Advanced Materials and Processes II
Issue date:
2012
Publication year:
2012
Pages:
1772-1776
Language:
English
ISSN:
10226680
ISBN-13:
9783037854570
Document type:
Conference article (CA)
Conference name:
2nd International Conference on Chemical Engineering and Advanced Materials, CEAM 2012
Conference date:
July 13, 2012 - July 15, 2012
Conference location:
Guangzhou, China
Conference code:
92757
Publisher:
Trans Tech Publications, P.O. Box 1254, Clausthal-Zellerfeld, D-38670, Germany
Abstract:
A new basic solution for eletroless Ni-B alloy plating from DMF was studied. The effects of composition and operating conditions on the rate of deposition of Ni-B alloy have also been discussed. The alloy component was analyzed by EDS and Inductively Coupled Plasma (ICP). The plating rate is determined by electronic balance. And structures of the plating coatings were investigated by means of scanning electron microscopy (SEM) and X-ray diffraction (XRD). The optimum composition and operating conditions for abstaining satisfied Ni-B alloy coating are provided. © (2012) Trans Tech Publications, Switzerland.
Number of references:
17
Main heading:
Alloys
Controlled terms:
Coatings - Electroless plating - Inductively coupled plasma - Metal cladding - Scanning electron microscopy - X ray diffraction
Uncontrolled terms:
Alloy coatings - Alloy components - Alloy plating - Basic solutions - DMF - Electroless - Electronic balances - Operating condition - Optimum composition - Plating rates - Rate of deposition - Room temperature
Classification code:
932.3 Plasma Physics - 931.3 Atomic and Molecular Physics - 741.1 Light/Optics - 539.3.2 Electroless Plating - 539 Metals Corrosion and Protection; Metal Plating - 538.2 Welding - 531.1 Metallurgy
DOI:
10.4028/www.scientific.net/AMR.557-559.1772
Database:
Compendex |
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