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telepathor
гæ (³õÈëÎÄ̳)
- Ó¦Öú: 0 (Ó×¶ùÔ°)
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- Ìû×Ó: 12
- ÔÚÏß: 10·ÖÖÓ
- ³æºÅ: 1513291
- ×¢²á: 2011-11-28
¡¾´ð°¸¡¿Ó¦Öú»ØÌû
¡ï
°®ÓëÓêÏÂ(½ð±Ò+1): 2011-11-28 12:05:40
°®ÓëÓêÏÂ(½ð±Ò+1): 2011-11-28 12:05:40
| To obtain a high peel strength, in addition to a good interface with the copper film role, but also need to have a higher film cohesive strength. A low peel strength causes precisely because of its low cohesive strength. Here "cohesive strength" and "tensile strength" two concepts are not identical. Because the tensile strength of the film along the film plane of the film breaking strength, and peel strength when the cohesion of the film is mainly in the plane perpendicular to the direction of the breaking strength. Usually the molecular chain of the film there is a greater degree along the film plane orientation, therefore, can not be the same strength in both directions, which means that, PI3 does not mean that the tensile strength of its cohesive strength when peeling big. The copper thin film near the interface with the existence of "weak boundary layer" will film in the region increased cohesive strength and bulk tensile strength difference. Therefore, here only shows that the cohesive strength of the boundary region is small and can not say that the tensile strength of small. |
4Â¥2011-11-28 11:25:26
terry_well
ÈÙÓþ°æÖ÷ (ÖªÃû×÷¼Ò)
Ц°¾½¬ºý¡ª¡ªÂúÄÔ½¬ºý
- ·ÒëEPI: 160
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- ¹ó±ö: 1.508
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- É¢½ð: 9654
- ºì»¨: 229
- ɳ·¢: 11
- Ìû×Ó: 5857
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- ³æºÅ: 352600
- ×¢²á: 2007-04-22
- ÐÔ±ð: GG
- רҵ: ȼÉÕѧ
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¡¾´ð°¸¡¿Ó¦Öú»ØÌû
¡ï
°®ÓëÓêÏÂ(½ð±Ò+1): 2011-11-26 08:09:17
yongbinz(½ð±Ò+80, ·ÒëEPI+1): 2011-11-26 17:05:39
yongbinz(½ð±Ò+70): 2011-11-28 19:19:28
°®ÓëÓêÏÂ(½ð±Ò+1): 2011-11-26 08:09:17
yongbinz(½ð±Ò+80, ·ÒëEPI+1): 2011-11-26 17:05:39
yongbinz(½ð±Ò+70): 2011-11-28 19:19:28
|
Inorder to obtain high peel strength, not only a better interfacial bond strength between the thin films and the copper but also a higher cohesive strength of such films are neccessary. The cause of the weak peel strength for A should be its lower cohesive strength. The cohesive strength reffered herein is completely different from the tensile strength which is a kind strength that related to the breaking of surface which is parallel to the surface, whereas cohesive strength is mainly based on the vertical breaking strength of the film. Generally speaking, the molecules of the film are to a greater extent orientated along with the surface direction, which suggests that the strength along with these two directions is different. The higher tensile strength of PI3 thereby can not illustrate its higher cohesive strength. However, there is weak interfacial layer between the thin films and the copper which might cause higher difference between values of cohesive strength and tensile strength in such region. In short, it could merely indicate that the cohesive strength of boundary region is weak instead of its tensile strength. ½ö¹©²Î¿¼£¬Ï£Íû¶ÔÄãÓÐËù°ïÖú¡£ |

2Â¥2011-11-25 22:50:16
zyblhyzyx
Òø³æ (ÖøÃûдÊÖ)
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- ×¢²á: 2010-08-20
- רҵ: ¸ß·Ö×Ó²ÄÁϽṹÓëÐÔÄÜ
¡ï
°®ÓëÓêÏÂ(½ð±Ò+1): 2011-11-26 08:09:25
°®ÓëÓêÏÂ(½ð±Ò+1): 2011-11-26 08:09:25
| To obtain high peel strength, it is necessary to improve both the bonding strength of film/copper at the interface and the cohesive strength of film itself in the boundary layer near the interface. The cause of the weak peel strength for A should be the low cohesive strength of the film. The tensile strength of the film reflected the fracture strength on in-plane direction, wheras the cohesive strength presented the shear strength on out-of-plane direction. Therefore, in this article the tensile strength of the film on in-plane orientation was not identical to the cohesive strength of the film on out-plane orientation. Further, the existence of the ¡°weak boundary layer¡± near the interface might cause higher difference between the cohesive strength and tensile strength. In short, thei film with the excellent tensile strength may not necessarily have a high peel strength value. |

3Â¥2011-11-26 00:14:29













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