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【答案】应助回帖
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爱与雨下(金币+1): 2011-11-26 08:09:17
yongbinz(金币+80, 翻译EPI+1): 2011-11-26 17:05:39
yongbinz(金币+70): 2011-11-28 19:19:28
Inorder to obtain high peel strength, not only a better interfacial bond strength between the thin films and the copper but also a higher cohesive strength of such films are neccessary. The cause of the weak peel strength for A should be its lower cohesive strength. The cohesive strength reffered herein is completely different from the tensile strength which is a kind strength that related to the breaking of surface which is parallel to the surface, whereas cohesive strength is mainly based on the vertical breaking strength of the film. Generally speaking, the molecules of the film are to a greater extent orientated along with the surface direction, which suggests that the strength along with these two directions is different. The higher tensile strength of PI3 thereby can not illustrate its higher cohesive strength. However, there is weak interfacial layer between the thin films and the copper which might cause higher difference between values of cohesive strength and tensile strength in such region. In short, it could merely indicate that the cohesive strength of boundary region is weak instead of its tensile strength.
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