| 查看: 830 | 回复: 8 | ||
| 【奖励】 本帖被评价8次，作者hjhw9513增加金币 7.5 个 | ||
| 当前主题已经存档。 | ||
[资源]
Microelectronic Packaging (New Trends in Electrochemical Technology)
|
||
|
Microelectronic Packaging (New Trends in Electrochemical Technology) ISBN: 041531190X | Author: M. Datta (Editor), Tetsuya Osaka (Editor), J. Walter Schultze (Editor) | Publisher: CRC | Publication Date: 2004-12-20 | Number Of Pages: 568 | Average Amazon Rating: 5.0 | Filetype: PDF | Filesize: 36M Book Description Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, then discusses chip metallization topics. It explores key aspects of chip-package interconnect technologies, and analyzes packages, boards, and connectors. It concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. http://rapidshare.com/files/4633280/Microelectronic_Packaging.pdf |
回复此楼» 猜你喜欢
拟解决的关键科学问题还要不要写
已经有8人回复
-
26申博
已经有3人回复
-
存款400万可以在学校里躺平吗
已经有22人回复
-
最失望的一年
已经有4人回复
-
国自然申请面上模板最新2026版出了吗？
已经有19人回复
-
请教限项目规定
已经有3人回复
-
基金委咋了？2026年的指南还没有出来？
已经有10人回复
-
基金申报
已经有6人回复
-
推荐一本书
已经有13人回复
-
疑惑？
已经有5人回复
3楼2006-11-25 23:08:51
4楼2006-11-26 00:49:11
6楼2006-12-05 13:48:23
简单回复
sinapdb2楼
2006-11-25 14:35
回复
2006-11-26 10:44
回复
2006-12-06 06:22
回复
2006-12-06 12:55
回复
skyflyzw9楼
2006-12-07 13:11
回复