| 查看: 815 | 回复: 8 | ||
| 【奖励】 本帖被评价8次，作者hjhw9513增加金币 7.5 个 | ||
| 当前主题已经存档。 | ||
[资源]
Microelectronic Packaging (New Trends in Electrochemical Technology)
|
||
|
Microelectronic Packaging (New Trends in Electrochemical Technology) ISBN: 041531190X | Author: M. Datta (Editor), Tetsuya Osaka (Editor), J. Walter Schultze (Editor) | Publisher: CRC | Publication Date: 2004-12-20 | Number Of Pages: 568 | Average Amazon Rating: 5.0 | Filetype: PDF | Filesize: 36M Book Description Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, then discusses chip metallization topics. It explores key aspects of chip-package interconnect technologies, and analyzes packages, boards, and connectors. It concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. http://rapidshare.com/files/4633280/Microelectronic_Packaging.pdf |
回复此楼» 猜你喜欢
A期刊撤稿
已经有5人回复
-
临港实验室与上科大联培博士招生1名
已经有8人回复
-
26申博自荐
已经有7人回复
-
想换工作。大多数高校都是 评职称时 认可5年内在原单位取得的成果吗？
已经有4人回复
-
带资进组求博导收留
已经有9人回复
-
求助大佬们，伤口沾上了乙腈
已经有6人回复
-
最近几年招的学生写论文不引自己组发的文章
已经有9人回复
3楼2006-11-25 23:08:51
4楼2006-11-26 00:49:11
6楼2006-12-05 13:48:23
简单回复
sinapdb2楼
2006-11-25 14:35
回复
2006-11-26 10:44
回复
2006-12-06 06:22
回复
2006-12-06 12:55
回复
skyflyzw9楼
2006-12-07 13:11
回复