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Microelectronic Packaging (New Trends in Electrochemical Technology)
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Microelectronic Packaging (New Trends in Electrochemical Technology) ISBN: 041531190X | Author: M. Datta (Editor), Tetsuya Osaka (Editor), J. Walter Schultze (Editor) | Publisher: CRC | Publication Date: 2004-12-20 | Number Of Pages: 568 | Average Amazon Rating: 5.0 | Filetype: PDF | Filesize: 36M Book Description Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, then discusses chip metallization topics. It explores key aspects of chip-package interconnect technologies, and analyzes packages, boards, and connectors. It concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. http://rapidshare.com/files/4633280/Microelectronic_Packaging.pdf |
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