| 查看: 852 | 回复: 8 | ||
| 【奖励】 本帖被评价8次，作者hjhw9513增加金币 7.5 个 | ||
| 当前主题已经存档。 | ||
[资源]
Microelectronic Packaging (New Trends in Electrochemical Technology)
|
||
|
Microelectronic Packaging (New Trends in Electrochemical Technology) ISBN: 041531190X | Author: M. Datta (Editor), Tetsuya Osaka (Editor), J. Walter Schultze (Editor) | Publisher: CRC | Publication Date: 2004-12-20 | Number Of Pages: 568 | Average Amazon Rating: 5.0 | Filetype: PDF | Filesize: 36M Book Description Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, then discusses chip metallization topics. It explores key aspects of chip-package interconnect technologies, and analyzes packages, boards, and connectors. It concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. http://rapidshare.com/files/4633280/Microelectronic_Packaging.pdf |
回复此楼» 猜你喜欢
281求调剂（0805）
已经有8人回复
-
环境领域全国重点实验室招收博士1-2名
已经有3人回复
-
材料专硕306英一数二
已经有10人回复
-
301求调剂
已经有6人回复
-
一志愿天津大学化学工艺专业（081702）315分求调剂
已经有7人回复
-
302求调剂
已经有6人回复
-
26博士申请
已经有3人回复
-
268求调剂
已经有3人回复
-
311求调剂
已经有10人回复
-
被我言中：新模板不强调格式了，假专家开始管格式了
已经有4人回复
3楼2006-11-25 23:08:51
4楼2006-11-26 00:49:11
6楼2006-12-05 13:48:23
简单回复
sinapdb2楼
2006-11-25 14:35
回复
2006-11-26 10:44
回复
2006-12-06 06:22
回复
2006-12-06 12:55
回复
skyflyzw9楼
2006-12-07 13:11
回复
50