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zhouzwsz

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Fabrication of Ge PIN photodiodes on silicon on insulator substrates under normal incidence

SOI 基垂直入射Ge PIN 光电探测器的研制  光电子。激光
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GeEpilayeranddeviceonSiSubstrate
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chensijie

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zhouzwsz(金币+10): Thank you 2011-05-06 00:30:43
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Originally posted by zhouzwsz at 2011-05-05 19:32:34:
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Fabrication of Ge PIN photodiodes on silicon on insulator substrates under normal incidence

SOI 基垂直入射Ge PIN 光电探测器的研制  光电子。激光

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Accession number:  20105013489488

Title:  Fabrication of Ge PIN photodiodes on silicon-on-insulator substrates under normal incidence

Authors:  Zhou, Zhi-Wen1 ; He, Jing-Kai1 ; Wang, Rui-Chun1 ; Li, Cheng2 ; Yu, Jin-Zhong3  

Author affiliation:  1  Shenzhen Institute of Information Technology, Shenzhen Institute of Information and Technology, Shenzhen 518029, China

2  Semiconductor Photonics Research Center, Department of Physics, Xiamen University, Xiamen 361005, China

3  State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China


Corresponding author:  Zhou, Z.-W. (zhouzw@sziit.com.cn)  

Source title:  Guangdianzi Jiguang/Journal of Optoelectronics Laser

Abbreviated source title:  Guangdianzi Jiguang

Volume:  21

Issue:  11

Issue date:  November 2010

Publication year:  2010

Pages:  1609-1613

Language:  Chinese

ISSN:  10050086

CODEN:  GUJIE9

Document type:  Journal article (JA)

Publisher:  Board of Optronics Lasers, No. 47 Yang-Liu-Qing Ying-Jian Road, Tian-Jin City, 300380, China

Abstract:  A Ge PIN photodiode under normal incidence operating in the near infrared region is demonstrated on the silicon-on-insulator(SOI) substrate. The epitaxial Ge layers are prepared in an ultrahigh vacuum chemical vapor deposition system using low temperature Ge buffer technique. The results show that the dark current density of the device dominated by the surface leakage decreases with the mesa length increasing, and 17.2 mA/cm2 is obtained at 2 V reverse bias. A responsivity of 0.22 A/W at the wavelength of 1.31 μm corresponding to an external quantum efficiency of 20.8% is presented. The spectral response under zero bias shows four resonant peaks located at approximately 1.25 μm, 1.35 μm, 1.45 μm and 1.55 μm, respectively in the wavelength range from 1.2 μm to 1.6 μm with the full width at half maximum of nearly 50 nm. The resonant enhancement effect is attributed to the high reflectivity of the SOI wafer. The simulated response spectrum utilizing scattering matrix method perfectly matches the measured data.

Number of references:  18

Main heading:  Tensile strain

Controlled terms:  Chemical vapor deposition  -  Electron energy levels  -  Germanium  -  Photodiodes  -  Scattering parameters  -  Silicon wafers  -  Substrates

Uncontrolled terms:  External quantum efficiency  -  High reflectivity  -  Low temperatures  -  Measured data  -  Near infrared region  -  Normal incidence  -  Pin photodiode  -  Resonant enhancements  -  Resonant peaks  -  Responsivity   -  Reverse bias  -  Scattering matrix method  -  Silicon-on-insulator substrates  -  Simulated response  -  SOI wafers  -  Spectral response  -  Surface leakage  -  Ultrahigh vacuum chemical vapor deposition systems  -  Wavelength ranges  -  Zero bias

Classification code:  932 High Energy Physics; Nuclear Physics; Plasma Physics  -  804 Chemical Products Generally  -  802.2 Chemical Reactions  -  801 Chemistry  -  933 Solid State Physics  -  741.3 Optical Devices and Systems  -  703.1 Electric Networks  -  461 Bioengineering and Biology  -  421 Strength of Building Materials; Mechanical Properties  -  712.1.1 Single Element Semiconducting Materials

Database:  Compendex

   Compilation and indexing terms, © 2011 Elsevier Inc.
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