|
|
【答案】应助回帖
yongbinz(金币+20, 翻译EPI+1):变化不大呀，但是还是感谢！ 2010-10-29 15:51:32
呵呵 没变动多少
A new co-polyimide was prepared from BOA and OPA with BTDA at a diamine molar ratio of 7:3. The homo-polyimides were also prepared. The aggregation structure and properties of the copolyimide are compared with those of the homopolymers. The copolyimide film showed high level of tensile strength, 202.56 MPa, high modulus, 4.00 Gpa, good thermal stability, glass transition temperature, 379 oC, and low water absorption ratio, 0.05%. The adhesion and thermo-dimensional stability of the corresponding polyimide based on two-layer flexible copper clad laminates were investigated. The copolyimide based on two-layer FCCL had a peel strength up to 1.02 Kg/cm, and maintained excellent thermo-dimensional stability. Possible mechanisms for improved adhesion were investigated using scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). It is postulated that the improved adhesion was ascribed to the enhanced polyimide/copper interfacial interactions with the improved cohesive strength of polyimide itsellf in boundary layer near the interface. |
|
回复此楼