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A new co-polyimide was prepared from BOA and OPA with BTDA at a diamine molar ratio of 7:3. The homo-polyimides were also prepared. The aggregation structure and the properties of the copolyimide are compared with those of the homopolymers. The copolyimide film showed high levels of tensile strength, 202.56 MPa, high modulus, 4.00 Gpa, good thermal stability, a glass transition temperature, 379 oC, and a low water absorption ratio, 0.05%. The adhesion and thermo-dimensional stability of the corresponding polyimide based two-layer flexible copper clad laminates were investigated. The copolyimide based two-layer FCCL had a peel strength up to 1.02 Kg/cm, while maintaining excellent thermo-dimensional stability. Possible mechanisms for improved adhesion were investigated using scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). It is postulated that the improved adhesion was ascribed to the enhanced polyimide/copper interfacial interactions with the improved cohesive strength of polyimide itsellf in boundary layer near the interface. 请高手招！ |
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crazybioinfo
金虫 (正式写手)
- 翻译EPI: 17
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【答案】应助回帖
yongbinz(金币+20, 翻译EPI+1):变化不大呀，但是还是感谢！ 2010-10-29 15:51:32
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呵呵 没变动多少 A new co-polyimide was prepared from BOA and OPA with BTDA at a diamine molar ratio of 7:3. The homo-polyimides were also prepared. The aggregation structure and properties of the copolyimide are compared with those of the homopolymers. The copolyimide film showed high level of tensile strength, 202.56 MPa, high modulus, 4.00 Gpa, good thermal stability, glass transition temperature, 379 oC, and low water absorption ratio, 0.05%. The adhesion and thermo-dimensional stability of the corresponding polyimide based on two-layer flexible copper clad laminates were investigated. The copolyimide based on two-layer FCCL had a peel strength up to 1.02 Kg/cm, and maintained excellent thermo-dimensional stability. Possible mechanisms for improved adhesion were investigated using scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). It is postulated that the improved adhesion was ascribed to the enhanced polyimide/copper interfacial interactions with the improved cohesive strength of polyimide itsellf in boundary layer near the interface. |
2楼2010-10-29 15:17:20
【答案】应助回帖
yongbinz(金币+20):谢谢您 的建议！ 2010-10-30 00:35:16
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第二句The aggregation structure and the properties of the copolyimide are compared with those of the homopolymers 是不是改成 The aggregation structure and the properties of the copolyimide and homopolymers are compared and analyzed.好一些？ 第三句 The copolyimide film showed high level of tensile strength, 202.56 MPa, high modulus, 4.00 Gpa, good thermal stability, glass transition temperature, 379 oC, and low water absorption ratio, 0.05%. 是不是改成 The copolyimide film showed a high level of tensile strength, 202.56 MPa, a high modulu of 4.00 Gpa, a high glass transition temperature of 379 ℃ showing a good thermal stability and a low water absorption ratio of 0.05%. 第四句strength up to 1.02 Kg/cm, and maintained …… 是不是加个the？改为strength up to 1.02 Kg/cm, and the maintained …… 第五局It is postulated that 是不是改为It is concluded that好些，你之前用的是假设，倾向是事先条件的假设那种含义，感觉不合适啊。现在改为推断，强调结论得出。 第六句ascribed to the enhanced polyimide/copper interfacial interactions with the improved cohesive strength of polyimide itsellf in boundary layer near the interface. 是不是改为ascribed to the enhanced interaction of the polyimide/copper interface and the improved cohesive strength of polyimide in the boundary layer near the interface. |
3楼2010-10-29 20:44:15