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[½»Á÷] IEEE EDL Rejected ÒÑÓÐ6È˲ÎÓë

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Reviewer: 1
> In summary, the paper borrows quite
> heavily from extant literature on ******
> while not adding much in way of new insights. Consequently,
> I deem the paper unworthy of publication in IEEE Electron
> Device Letters.

Reviewer: 2
> The value of this work will stand out if the
> computed/simulated temperature profile can be validated with
> experimental data.
£¨±¾ÈË×öµÄÊÇ·ÂÕæµÄ¹¤×÷£¬Ã»ÓÐʵÑéÌõ¼þ£¬×ö²»³ÉʵÑ飩

Reviewer: 3
> This is a generally well-written paper which fills an
> existing gap between simulation studies of CNT
> interconnects. I would recommend this for publication, after
> several major points are addressed:

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