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| Tensile fracture analysis was adopted to further understand the effect of electroless plating on strengthening behavior of the composites. Fig. 9 presented SEM images and EDS spectra of the fracture of the composites and pure Cu. Dimples distributed on the fracture surface, illustrating a typical plastic fracture of all samples. The corresponding EDS spectra confirmed the presence of Cf after tensile tests. Fig. 9(b) showed that the Cf agglomerated heavily when they were directly added. The cracks extended along the interface before the stress could transfer from the matrix to Cf , which reduced the strength of the composite. Moreover, the agglomerates could promote the formation of pores during sintering process. Fig. 8(a) showed that the relative density of 0.5% Cf /Cu composite was 90%, suggesting a large number of porosity. Thus, the Cf acted as weak phase and reduced the mechanical property of the composite. The plated Cf uniformly distributed on the fracture surface proving that the agglomeration was inhibited efficiently by inhibition effect of electroless plating. Fig. 9(c) and (d) showed that the plated Cf were tightly embedded in the matrix or pulled out, indicating a high adhesive strength of the GNPs-matrix interface. As TEM analysis of Fig. 6 and 7, good interfacial bonding was attributed to the plated metal particles. |
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