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chenchang420木虫 (小有名气)
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[交流]
《Materials for Information Technology》
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Materials for Information Technology Devices, Interconnects and Packaging Book Series Engineering Materials and Processes ISSN 1619-0181 Subject Engineering, Metallic Materials, Ceramics, Glass, Composites, Natural Methods, Surfaces and Interfaces, Thin Films, Electronics and Microelectronics, Instrumentation, Physics and Applied Physics in Engineering and Solid State Physics and Spectroscopy Publisher Springer London DOI 10.1007/1-84628-235-7 Copyright 2005 ISBN 978-1-85233-941-8 Pick It! (Print) 978-1-84628-235-5 Pick It! (Online) Subject Collection Engineering Subject Engineering, Metallic Materials, Ceramics, Glass, Composites, Natural Methods, Surfaces and Interfaces, Thin Films, Electronics and Microelectronics, Instrumentation, Physics and Applied Physics in Engineering and Solid State Physics and Spectroscopy SpringerLink Date Sunday, July 02, 2006 下载地址： http://www.namipan.com/d/b8662ce ... e636faf39cace4f4000 [ Last edited by FLY_Phoenix on 2008-6-22 at 23:54 ] |
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