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【英美经典书籍】《Handbook of Thin Film Deposition》(第3版)【已搜索，无重复】
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【英美经典书籍】《Handbook of Thin Film Deposition》(第3版)【已搜索，无重复】 【已搜索，无重复】论坛里，有个同名的帖子，连接已经失效了，而且只是第2版。 失效帖子的链接地址：http://muchong.com/bbs/viewthread.php?tid=3297120&fpage=1&target=blank 为此，我上传这本书，供朋友们学习和参考。 我上传的这本书： 作者：Krishna Seshan 2012年，293 页，PDF 格式，19 MB。 Language: English . 封面： 。  。 简介： "The Handbook of Thin Film Deposition" is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, new materials for memory applications and methods for thin film optical processes. In a major restructuring, this edition of the handbook lays the foundations with an up-to-date treatment of lithography, contamination and yield management, and reliability of thin films. The established physical and chemical deposition processes and technologies are then covered, the last section of the book being devoted to more recent technological developments such as microelectromechanical systems, photovoltaic applications, digital cameras, CCD arrays, and optical thin films. This is a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance and applications. It covers core processes and applications in the semiconductor industry and new developments in the photovoltaic and optical thin film industries. The new edition takes covers the transition taking place in the semiconductor world from Al/SiO2 to copper interconnects with low-k dielectrics. It is written by acknowledged industry experts from key companies in the semiconductor industry including Intel and IBM. It is foreword by Gordon E. Moore, co-founder of Intel and formulator of the renowned 'Moore's Law' relating to the technology development cycle in the semiconductor industry. ============================== 敬请各位朋友，下载之后，给个回帖评价。我也好继续推出下一个最新科技书籍。 (不下载，也可以评价。) 谢谢！ |
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2014-12-22 04:59:24, 19.05 M
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2014-12-22 08:13
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