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2012年新著——二维纳米结构（英文版）
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Two-Dimensional Nanostructures by Mahmood Aliofkhazraei and Nasar Ali English | ISBN: 1439866651 | 2012 | PDF | 309 pages | 8,9 MB After the 2010 Nobel Prize in Physics was awarded to Andre Geim and Konstantin Novoselov "for groundbreaking experiments regarding the two-dimensional material graphene," even more research and development efforts have been focused on two-dimensional nanostructures. Illustrating the importance of this area in future applications, Two-Dimensional Nanostructures covers the fabrication methods and properties of these materials. The authors begin with discussions on the properties, size effect, applications, classification groups, and growth of nanostructures. They then describe various characterization and fabrication methods, such as spectrometry, low-energy electron diffraction, physical and chemical vapor deposition, and molecular beam epitaxy. The remainder of the text focuses on mechanical, chemical, and physical properties and fabrication methods, including a new mechanical method for fabricating graphene layers and a model for relating the features and structures of nanostructured thin films. With companies already demonstrating the capabilities of graphene in a flexible touch-screen and a 150 GHz transistor, nanostructures are on their way to replacing silicon as the materials of choice in electronics and other areas. This book aids you in understanding the current chemical, mechanical, and physical processes for producing these "miracle materials." Contents Preface............................................................................................. .........................xi 1 Synthesis, Processing, and Application of Nanostructures................... 1 1.1 Introduction to Nanotechnology ........................................................ 1 1.2 History of Nanotechnology................................................................. 2 1.3 What Is a Nanomaterial?...................................................................... 3 1.4 Properties of Nanostructured Materials ........................................... 6 1.4.1 Physical Properties .................................................................. 9 1.4.1.1 Diffusion Coefficient................................................ 9 1.4.1.2 Thermal Expansion Coefficient............................ 12 1.4.1.3 Electrical Resistance............................................... 14 1.4.1.4 Solubility of Alloy Elements ................................. 15 1.4.1.5 Magnetic Properties............................................... 15 1.4.1.6 Corrosion Resistance ............................................. 17 1.4.1.7 Hydrogen Capacitance Properties ....................... 18 1.4.2 Mechanical Properties .......................................................... 18 1.4.2.1 Elastic Properties.................................................... 19 1.4.2.2 Plastic Properties .................................................... 20 1.4.2.3 Superplasticity ........................................................ 27 1.5 Thermal Stability of Nanostructures ............................................... 31 1.6 Nanotechnology and Future Perspectives ...................................... 36 1.7 Some Applications of Nanostructures............................................. 38 1.7.1 Nanoelectronic and Molecular Electronic.......................... 38 1.7.2 Nanorobots ............................................................................. 38 1.7.3 Biological Applications ......................................................... 38 1.7.4 Catalytic Applications ........................................................... 39 References .................................................................................................... ... 39 2 Classification of Two-Dimensional Nanostructures............................. 51 2.1 Introduction ......................................................................................... 51 2.2 Various Methods for Production of Nanostructures ..................... 51 2.2.1 Producing Nanoparticles by the Sol-Gel Process.............. 52 2.2.2 Production of Nanoparticles by the Chemical Deposition Method ................................................................ 52 2.2.3 Production of Nanoparticles by the Hydrothermal Method ... 53 2.2.4 Production of Nanoparticles by the Pyrolysis Method.... 53 2.2.5 Production of Nanoparticles by Chemical Vapor Deposition (CVD) ....................................................... 54 2.2.6 Solid-State Processes ............................................................. 54 2.2.7 Advanced Methods ............................................................... 54 2.3 Physical and Chemical Analysis of Nanoparticles ........................ 55 2.3.1 X-Ray Diffraction (XRD) ....................................................... 55 2.3.2 Scanning Electron Microscopy (SEM) ................................ 56 2.3.3 Transmission Electron Microscopy (TEM)......................... 56 2.3.4 Optical Spectrometry ............................................................ 56 2.3.5 Ultraviolet (UV)-Visible Spectroscopy................................ 57 2.3.6 Fluorescence ........................................................................... 57 2.3.7 Fourier Transform Infrared Spectrometry (FTIR) ............ 57 2.4 Different Forms of Growth ................................................................ 58 2.5 Relation between Growth and Energy Level.................................. 59 2.6 Overaturation Effect on Growth ....................................................... 60 2.7 Quantitative Description of Initial Stages of Film Growth........... 62 2.7.1 Volmer–Weber Theory .......................................................... 62 2.7.2 Three-Dimensional (3D) Island Growth............................. 62 2.7.3 Two-Dimensional (2D) Film Growth .................................. 63 2.8 Kinetic Theory of Growth.................................................................. 64 2.9 Orientation of Thin Films .................................................................. 67 2.10 Film Growth with a Certain Orientation......................................... 68 2.11 Film–Substrate Interfaces................................................................... 69 2.11.1 Abrupt Interface (Single Layer on Single Layer) ............... 69 2.11.2 Interface with Chemical Bond ............................................. 69 2.11.3 Distributed Film–Substrate Interfaces ................................ 69 2.11.4 Semidistribution Film–Material Interface.......................... 70 2.11.5 Mechanical Film–Substrate Interface.................................. 71 References .................................................................................................... ... 71 3 Characterization and Fabrication Methods of Two-Dimensional Nanostructures...................................................................................... ........ 81 3.1 Introduction ......................................................................................... 81 3.2 Silicon (Si) ............................................................................................. 82 3.3 Dimer-Adatom-Stacking Fault (DAS) Model .................................. 83 3.4 Auger Electron Spectrometry (AES)................................................. 84 3.5 Low-Energy Electron Diffraction (LEED) Technique .................... 85 3.6 X-Ray Phototransmission Spectrometry.......................................... 85 3.7 Physical Vapor Deposition (PVD) Methods .................................... 86 3.7.1 Thermal Evaporation............................................................. 86 3.7.2. Evaporation Sources .............................................................. 87 3.7.2.1 Resistive Heating.................................................... 88 3.7.2.2 Flash Evaporation................................................... 88 3.7.2.3 Arc Evaporation...................................................... 89 3.7.2.4 Laser Evaporation................................................... 91 3.7.2.5 Application of Electron Bombardment ............... 92 3.7.2.6 Evaporation through Radio Frequency (RF) Heating............................................................ 93 3.7.3 Sputtering Method................................................................. 93 3.7.3.1 Reactive and Nonreactive Processes ................... 93 3.7.3.2 Diode Sputtering .................................................... 94 3.7.3.3 RF Sputtering .......................................................... 94 3.7.3.4 Triode Sputtering ................................................... 95 3.7.3.5 Magnetron Sputtering ........................................... 96 3.7.3.6 Unbalanced Magnetron Sputtering..................... 98 3.8 Chemical Vapor Deposition (CVD) ................................................ 101 3.8.1 Introduction .......................................................................... 101 3.8.2 CVD System Requirements ................................................ 105 3.8.2.1 Gas Distribution System...................................... 105 3.8.2.2 CVD Reactors........................................................ 105 3.8.3 Plasma-Assisted Chemical Vapor Deposition (PACVD) ....109 3.8.3.1 Analysis of Physical and Chemical Aspects of Electrical Discharge......................................... 109 3.8.3.2 Main Processes of Plasma Medium................... 112 3.8.3.3 Kinetic and Thermodynamic Factors................ 113 3.8.3.4 Interactions between Plasma and Surface............115 3.8.4 Discharge System................................................................. 117 3.8.5 Advantages of the CVD Method ....................................... 117 3.8.6 Limitations and Disadvantages of CVD........................... 118 3.9 Molecular Beam Epitaxy (MBE)...................................................... 119 3.9.1 Ultrahigh (UHV) System .................................................... 119 3.9.2 Substrate Heater and Preserver ......................................... 121 3.9.3 Source Cell for MBE............................................................. 121 3.10 Ion Beam Assisted Film Deposition ............................................... 122 3.10.1 Partially Ionized Molecular Beam Epitaxy (PI-MBE)..... 122 3.10.2 Implant-Epitaxy Rig ............................................................ 123 3.10.3 IVD Technique ..................................................................... 124 3.10.4 Double Ionic Beam (DIB) Technique ................................. 126 3.10.5 Ionized Cluster Beam (ICB) ................................................ 127 3.10.5.1 Physical Process.................................................... 127 3.10.5.2 ICB Rig ................................................................... 127 3.10.5.3 ICB Advantages and Specifications ................... 127 3.11 Pulsed Laser Deposition (PLD)....................................................... 129 3.12 Chemical Bath Deposition (CBD).................................................... 130 References .................................................................................................... . 135 4 Mechanical Fabrication/Properties of Two-Dimensional Nanostructures...................................................................................... ...... 141 4.1 Introduction ....................................................................................... 141 4.2 Multiple-Layer Coatings .................................................................. 142 4.3 Fabrication Methods of Multiple-Layer Coatings ........................ 144 4.3.1 Multiple-Layer Electrodeposition Using a Single Bath .....147 4.3.2 Mechanical Cleavage for Synthesis of Graphene Layers....149 4.3.3 Chemomechanical Synthesis of Thin Films .................... 150 4.3.3.1 HgxCd1–xSe Thin Films ........................................ 150 4.3.3.2 Cd1–xZnxSe Thin Films......................................... 154 4.3.4 Achieving Enhanced Mechanical Properties .................. 157 4.4 Examining the Characteristics of the Multiple-Layer Coatings....161 4.4.1 Mechanical Properties of the Multiple-Layer Nanostructures .................................................................... 161 4.4.2 Strengthening Theories in Multiple-Layer Systems ....... 162 4.4.2.1 Orowan Mechanism ............................................ 162 4.4.2.2 Hall–Patch Mechanism ....................................... 162 4.4.2.3 Reinforcing by Virtual Forces ............................ 163 4.4.3 An Example from Cubic Boron Nitride Thin Films........ 164 4.4.4 The Effect of the Supermodule in Multilayer Systems.... 169 4.4.5 Tribological Behavior of the Multilayer Coatings ........... 170 4.5 Examples of Mechanical Affected Properties of Two-Dimensional Nanostructures ................................................. 172 4.5.1 TiN/CrN Nanomultilayer Thin Film ................................ 172 4.5.2 Mechanical Properties of Thin Films Using Indentation Techniques....................................................... 175 4.5.3 Nanostructured Carbon Nitride Thin Films ................... 177 4.5.4 Au–TiO2 Nanocomposite Thin Films ................................ 179 4.5.5 Effect of Internal Stress on the Mechanical Property of Thin CNx Films ................................................................ 181 References .................................................................................................... . 185 5 Chemical/Electrochemical Fabrication/Properties of Two-Dimensional Nanostructures.......................................................... 191 5.1 Introduction ....................................................................................... 191 5.2 History ................................................................................................ 191 5.3 Direct Writing of Metal Nanostructures ....................................... 193 5.4 Theory and Thermodynamic Method of Codeposition.............. 196 5.4.1 Nucleation ............................................................................. 196 5.4.2 Growth................................................................................... 199 5.4.3 Ostwald Ripening................................................................ 200 5.4.4 Final Growth and Formation of Stable Nanoparticles ......201 5.5 Phase Transition of Two-Dimensional Nanostructure by Electrochemical Potential ................................................................ 206 5.6 Procurement of Nanomaterials through Deposition................... 210 5.6.1 Procurement of Metals from Aqueous Solutions............ 210 5.6.2 Deposition of Metals by Reduction of Nonaqueous Solutions................................................................................ 213 5.6.3 Deposition of Oxides from Aqueous Solutions............... 219 5.6.5 Nanoimprint Lithography for Fabrication of Plasmonic Arrays ................................................................. 223 5.7 Conclusion.......................................................................................... 228 References .................................................................................................... . 229 6 Physical and Other Fabrication/Properties of Two-Dimensional Nanostructures...................................................................................... ...... 235 6.1 Introduction ....................................................................................... 235 6.2 Concepts of Nanostructured Thin Films....................................... 235 6.3 Important Physical Fabrication Methods ...................................... 239 6.3.1 Excimer Laser ....................................................................... 239 6.3.2 Molecular Beam Epitaxy (MBE)......................................... 239 6.3.3 Ion Implantation................................................................... 240 6.3.4 Focused Ion Beam (FIB) in Nanotechnology ................... 241 6.3.5 FIB-SEM Dual Beam System .............................................. 241 6.3.6 Langmuir–Blodgett Film (LBF).......................................... 242 6.3.7 Electrospinning.................................................................... 243 6.4 Specification of Sculptured Thin Films ......................................... 243 6.5 Phase, Length, and Time Sandwich ............................................... 248 6.6 A Model to Make a Relation between Features and Structures of Dielectric Helicoidal Sculptured Thin Films ........ 257 6.7 Analysis of Precise Couple Wave for the Incident Transverse Wave..................................................... 266 6.8 Physical Principles and Applications of Different Fabrication Methods ......................................................................... 274 6.8.1 Excimer Laser ....................................................................... 274 6.8.2 Molecular Beam Epitaxy (MBE)......................................... 275 6.8.3 Ion Implantation................................................................... 277 6.8.3.1 Doping ................................................................... 278 6.8.3.2 Mesotaxy ............................................................... 279 6.8.3.3 Surface Operations............................................... 279 6.8.3.4 Amorphous Fabrication....................................... 280 6.8.4 Focused Ion Beam (FIB) in Nanotechnology ................... 280 6.8.5 FIB-SEM Dual Beam System .............................................. 281 6.8.6 Langmuir–Blodgett Film (LBF).......................................... 281 6.8.7 Electrospinning.................................................................... 282 s .................................................................................................... . 283 s .................................................................................................... . 283  English | ISBN: 1439866651 | 2012 | PDF | 309 pages | 8,9 MB |
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