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STUDY on CURING PROCESS, SURFACE STRENGTH and THERMAL DIFFUSIVITY of EPOXY NANOCOMPOSITES
×÷Õß:Xu, F (Xu, F.)[ 1 ] ; Han, ZD (Han, Z. D.); Zhou, HR (Zhou, H. R.)
Êé¼®ÍÅÌå×÷Õß:IEEE
2012 IEEE 10TH INTERNATIONAL CONFERENCE ON THE PROPERTIES AND APPLICATIONS OF DIELECTRIC MATERIALS (ICPADM)
´ÔÊé: International Conference on Properties and Applications of Dielectric Materials-ICPADM
³ö°æÄê: 2012
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»áÒé: 10th IEEE International Conference on the Properties and Applications of Dielectric Materials (ICPADM)
»áÒ鵨µã: Bangalore, INDIA
»áÒéÈÕÆÚ: JUL 24-28, 2012
»áÒéÔÞÖúÉÌ:IEEE, DEIS; Cent Power Res Inst
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This paper aims at improvmg the surface strength properties and thermal conductivity of epoxy resin by adding two kinds of nano-particles, inorganic alumina nano-particles and organic nitrile rubber nano-powders. The curing process of epoxy based nanocomposites was investigated by differential scanning calorimeter (DSC). The surface strength properties and thermal diffusivity were evaluated by dynamic ultra-micro hardness tester and laser flash method, respectively. The results indicated that the curing reaction of nanocomposites was influenced by the addition of nano-particles. Alumina nano-particles exerts stronger influence on the curing reaction than nitrile rubber nano-powders by showing higher curing temperature. Compared with pure epoxy resin, the nanocomposites with mixed nano alumina and nitrile rubber have lower curing temperature. When using these two kinds of nano-particles together, the surface hardness and the elastic modulus were improved, meanwhile, the creep-resistant and deformation-resistant properties were enhanced. As a result, the surface strength property of epoxy composites was improved with addition of nano-powders. Meanwhile, the thermal diffusivity of nanocomposites was enhanced with the addition of alumina. The nanocomposites with rubber nano-powders and alumina nano-particles have the similar thermal diffusivity with those with 20 wt% alumina nano-particles.
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×÷Õ߹ؼü´Ê:epoxy resin; nanocomposites; curing process; surface strength; thermal diffusivity
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ͨѶ×÷ÕßµØÖ·: Xu, F (ͨѶ×÷Õß)
[ÏÔʾÔöÇ¿×éÖ¯ÐÅÏ¢µÄÃû³Æ] Harbin Univ Sci & Technol, Sch Mat Sci & Engineer, Harbin 150040, Peoples R China.
µØÖ·:
[ÏÔʾÔöÇ¿×éÖ¯ÐÅÏ¢µÄÃû³Æ] [ 1 ] Harbin Univ Sci & Technol, Sch Mat Sci & Engineer, Harbin 150040, Peoples R China
µç×ÓÓʼþµØÖ·:zhidong.han@hrbust.edu.cn
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IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
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Ñо¿·½Ïò:Engineering
Web of Science Àà±ð:Engineering, Electrical & Electronic
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ÎÄÏ×ÀàÐÍ roceedings Paper
ÓïÖÖ:English
Èë²ØºÅ: WOS:000310350500049
ISBN:978-1-4673-2850-0
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IDS ºÅ: BCJ95
Web of Science ºËÐĺϼ¯ÖÐµÄ "ÒýÓõIJο¼ÎÄÏ×": 10
Web of Science ºËÐĺϼ¯ÖÐµÄ "±»ÒýƵ´Î": 0 |
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