| 查看: 508 | 回复: 1 | |||
cl6860金虫 (初入文坛)
|
[求助]
AMM 麻烦查一下这篇文章检索了吗？谢谢 已有1人参与
|
| 2013年机电一体化与信息技术（ICMIT 2013）桂林 Design and thermal analysis of SiGe HBT with segmented emitter fingers and non-uniform emitter finger spacing |
回复此楼» 猜你喜欢
售SCI一区文章，我:8 O5 51O 54,科目齐全
已经有4人回复
-
售SCI一区文章，我:8 O5 51O 54,科目齐全
已经有4人回复
-
售SCI一区文章，我:8 O5 51O 54,科目齐全
已经有5人回复
-
售SCI一区文章，我:8 O5 51O 54,科目齐全
已经有4人回复
-
售SCI一区文章，我:8 O5 51O 54,科目齐全
已经有6人回复
-
售SCI一区文章，我:8 O5 51O 54,科目齐全
已经有6人回复
-
售SCI一区文章，我:8 O5 51O 54,科目齐全
已经有6人回复
-
售SCI一区文章，我:8 O5 51O 54,科目齐全
已经有7人回复
-
售SCI一区文章，我:8 O5 51O 54,科目齐全
已经有7人回复
-
售SCI一区文章，我:8 O5 51O 54,科目齐全
已经有7人回复
» 本主题相关价值贴推荐，对您同样有帮助:
- 我有一篇ISTP会议论文，请哪位大侠帮我查下号
已经有6人回复
- 麻烦虫友帮助查找一下一篇文章是否已被检索？
已经有3人回复
- 求帮忙查一下：AMM.427-429上的一篇论文是否已检索！谢谢！
已经有3人回复
- 帮忙查AMM368-370上的两篇文章的检索情况
已经有3人回复
- 谁能帮忙查查AMM的V365~366有没有检索？里面的文章有检索的吗？
已经有5人回复
- 麻烦好心人给我查一下EI检索号，谢谢
已经有5人回复
- 广东商学院开的icseee 2012，请问AMM.291-294.561这篇文章检索了吗？
已经有32人回复
- 请问TTP公司的AMM检索到第几卷了。
已经有3人回复
- 请帮忙查询AMM检索信息
已经有5人回复
- 急用！！麻烦能查检索的楼主帮忙检索一下我的7篇文章是否被SCI、EI检索，十分感谢！
已经有7人回复
【答案】应助回帖
★ ★ ★ ★ ★
cl6860: 金币+5, ★★★★★最佳答案, 感谢 2014-02-02 10:00:50
cl6860: 金币+5, ★★★★★最佳答案, 感谢 2014-02-02 10:00:50
|
Accession number: 20140117159677 Title: Design and thermal analysis of SiGe HBT with segmented emitter fingers and non-uniform emitter finger spacing Authors: Chen, Liang1 Email author 30750574@163.com; Hu, Cheng Zhong1; Jiang, Chun Ling1 Author affiliation: 1 College of Physics and Electronic Engineering, TaiShan University, TaiAn, China Source title: Applied Mechanics and Materials Abbreviated source title: Appl. Mech. Mater. Volume: 462-463 Monograph title: Progress in Mechatronics and Information Technology Issue date: 2014 Publication year: 2014 Pages: 592-596 Language: English ISSN: 16609336 E-ISSN: 16627482 ISBN-13: 9783037859414 Document type: Conference article (CA) Conference name: 2013 International Conference on Mechatronics and Information Technology, ICMIT 2013 Conference date: October 19, 2013 - October 20, 2013 Conference location: Guilin, China Conference code: 101728 Sponsor: Korea Maritime University; Inha University; Hong Kong Industrial Technology Research Centre Publisher: Trans Tech Publications Ltd, Kreuzstrasse 10, Zurich-Durnten, CH-8635, Switzerland Abstract: A novel multi-finger power SiGe heterojunction bipolar transistor (HBT) with segmented emitter fingers and non-uniform emitter finger spacing was proposed to improve the thermal stability. Thermal simulation for a five-finger power SiGe HBT with novel structure was conducted with ANSYS software. Three-dimensional temperature distribution on emitter fingers was obtained. Compared with traditional emitter structure, the maximum junction temperature of novel structure reduce significantly from 429.025K to 414.252K, the thermal resistance reduce from 159K/W to 141K/W, temperature distribution were significantly improved. Thermal stability was effective enhanced. © (2014) Trans Tech Publications, Switzerland. Number of references: 13 Main heading: Heterojunction bipolar transistors Controlled terms: Heat resistance - Information technology - Temperature distribution - Thermoanalysis - Thermodynamic stability Uncontrolled terms: ANSYS software - Emitter fingers - Emitter structures - Junction temperatures - Non-uniform - Novel structures - SiGe heterojunction bipolar transistor - Thermal simulations Classification code: 641.1 Thermodynamics - 714.2 Semiconductor Devices and Integrated Circuits - 801 Chemistry - 903 Information Science - 931.2 Physical Properties of Gases, Liquids and Solids DOI: 10.4028/www.scientific.net/AMM.462-463.592 Database: Compendex Compilation and indexing terms, © 2013 Elsevier Inc. |
2楼2014-02-02 08:42:40
10