±±¾©Ê¯ÓÍ»¯¹¤Ñ§Ôº2026ÄêÑо¿ÉúÕÐÉú½ÓÊÕµ÷¼Á¹«¸æ
²é¿´: 4939  |  »Ø¸´: 95
¡¾½±Àø¡¿ ±¾Ìû±»ÆÀ¼Û80´Î£¬×÷ÕßÀ×¹âÔÂÔö¼Ó½ð±Ò 64 ¸ö
µ±Ç°Ö»ÏÔʾÂú×ãÖ¸¶¨Ìõ¼þµÄ»ØÌû£¬µã»÷ÕâÀï²é¿´±¾»°ÌâµÄËùÓлØÌû

À×¹âÔÂ

ľ³æÖ®Íõ (ÎÄ̳¾«Ó¢)


[×ÊÔ´] ¡ï¡ï¡ï¡ï¡ï¡ï¡ï20141ÉñÒ»ÑùµÄÊé¼®£¡£¡£¡Copper Wire Bonding

ÊéÃûPreeti S. Chauhan
Anupam Choubey
ZhaoWei Zhong
Michael G. Pecht
³ö°æÉçspringer
ISBN 978-1-4614-5760-2
1 Copper Wire Bonding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Wire Bonding Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Ball Bonding vs. Wedge Bonding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 From Gold to Cu Wire Bonding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Market Adoption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.5 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2 Bonding Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.1 Bond Wire . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.2 Oxidation Prevention Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.3 Free Air Ball Formation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.4 First (Ball) and Second (Wedge) Bond . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.5 Wire Bond Process Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.5.1 Ultrasonic Energy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.5.2 Electric Flame-Off Current and Firing Time . . . . . . . . . . . . . 21
2.5.3 Bond Force . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.5.4 Bonding Temperature and Time . . . . . . . . . . . . . . . . . . . . . . . . 26
2.6 Bonding Process Optimization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.7 Bonding Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.8 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3 Bonding Metallurgies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
3.1 Bare Copper (Cu) and Palladium-Coated Cu Wire . . . . . . . . . . . . . . . 39
3.2 Bare Cu Wire on Al Pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
3.3 Bare Cu Wire on Au- and Ni-Based Die Bond Pads . . . . . . . . . . . . . 44
3.4 Cu¨CCu Bond . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
3.5 Bond¨CPad Interfacial Metallurgies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3.5.1 Au¨CAl and Cu¨CAl Intermetallics . . . . . . . . . . . . . . . . . . . . . . . . 46
3.5.2 Cu¨CAu and Cu¨CAl Intermetallics . . . . . . . . . . . . . . . . . . . . . . . 54
3.5.3 Au¨CAuNi, Au¨CAuPdNi, Cu¨CAuNi, and Cu¨CAlPdNi . . . . . . . 55
3.6 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
4 Wire Bond Evaluation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4.1 Criteria for Good Bond Formation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4.2 Pre-bonding Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
xvii¡ï¡ï¡ï¡ï¡ï¡ï¡ï20141ÉñÒ»ÑùµÄÊé¼®£¡£¡£¡Copper Wire Bonding
38RJQ}L4$XGKZ0[V373~4%H.jpg


¡ï¡ï¡ï¡ï¡ï¡ï¡ï20141ÉñÒ»ÑùµÄÊé¼®£¡£¡£¡Copper Wire Bonding-1
QQͼƬ20140107230235.jpg
»Ø¸´´ËÂ¥

» ±¾Ìû¸½¼þ×ÊÔ´Áбí

  • »¶Ó­¼à¶½ºÍ·´À¡£ºÐ¡Ä¾³æ½öÌṩ½»Á÷ƽ̨£¬²»¶Ô¸ÃÄÚÈݸºÔð¡£
    ±¾ÄÚÈÝÓÉÓû§×ÔÖ÷·¢²¼£¬Èç¹ûÆäÄÚÈÝÉæ¼°µ½ÖªÊ¶²úȨÎÊÌ⣬ÆäÔðÈÎÔÚÓÚÓû§±¾ÈË£¬Èç¶Ô°æÈ¨ÓÐÒìÒ飬ÇëÁªÏµÓÊÏ䣺xiaomuchong@tal.com
  • ¸½¼þ 1 : Preeti_S_Chauhan,_Anupam_Choubey,_ZhaoWei_Zhong,_Michael_G_Pecht-Copper_Wir.pdf
  • 2014-01-07 23:03:59, 5.06 M

» ÊÕ¼±¾ÌûµÄÌÔÌûר¼­ÍƼö

¾­µä×ÊÔ´Ìû µç»¯Ñ§µçÔ´¡¢µçÔ´¹ÜÀí ÌÔÌùÌÔ±¦ ÎÒµÄÎļþ¡ª¡ªÖµµÃÊÕ²Ø
Book & Review °ì¹«¼¼Çɺ͵çÔ´¹ÜÀí ²ÄÁϹ¤³Ì

» ²ÂÄãϲ»¶

» ±¾Ö÷ÌâÏà¹Ø¼ÛÖµÌùÍÆ¼ö£¬¶ÔÄúͬÑùÓаïÖú:

ÒÑÔÄ   »Ø¸´´ËÂ¥   ¹Ø×¢TA ¸øTA·¢ÏûÏ¢ ËÍTAºì»¨ TAµÄ»ØÌû

smart_r

гæ (³õÈëÎÄ̳)


¡ï¡ï¡ï¡ï¡ï ÎåÐǼ¶,ÓÅÐãÍÆ¼ö

¶¥Ò»Ï£¬¸Ðл·ÖÏí£¡ºÃÊ飬ÕýºÃ½Ó´¥µ½Õâ·½ÃæµÄÄÚÈÝ£¬¹¤ÒÕ¼¼ÊõºÜУ¬Êǽ«À´µç×Ó·¢Õ¹µÄÇ÷ÊÆ
48Â¥2014-12-03 21:32:22
ÒÑÔÄ   »Ø¸´´ËÂ¥   ¹Ø×¢TA ¸øTA·¢ÏûÏ¢ ËÍTAºì»¨ TAµÄ»ØÌû
²é¿´È«²¿ 96 ¸ö»Ø´ð

demonjordan

ľ³æ (ÖøÃûдÊÖ)


¡ï¡ï¡ï¡ï¡ï ÎåÐǼ¶,ÓÅÐãÍÆ¼ö

Á˽âÁ˽⣬֮ǰֻÊÇÆ¤Ã«Á˽âbonding£¬ÏÖÔÚרҵÊé¿´¿´
4Â¥2014-01-08 08:51:17
ÒÑÔÄ   »Ø¸´´ËÂ¥   ¹Ø×¢TA ¸øTA·¢ÏûÏ¢ ËÍTAºì»¨ TAµÄ»ØÌû
¼òµ¥»Ø¸´
jtkdpangzi2Â¥
2014-01-08 00:03   »Ø¸´  
ÎåÐÇºÃÆÀ  ¶¥Ò»Ï£¬¸Ðл·ÖÏí£¡
zjys58873Â¥
2014-01-08 07:52   »Ø¸´  
ÎåÐÇºÃÆÀ  
2014-01-08 08:53   »Ø¸´  
¶¥Ò»Ï£¬¸Ðл·ÖÏí£¡
feng58007Â¥
2014-01-08 15:27   »Ø¸´  
ÎåÐÇºÃÆÀ  ¶¥Ò»Ï£¬¸Ðл·ÖÏí£¡
2014-01-08 16:02   »Ø¸´  
ÎåÐÇºÃÆÀ  ¶¥Ò»Ï£¬¸Ðл·ÖÏí£¡
cubane9Â¥
2014-01-08 20:51   »Ø¸´  
ÎåÐÇºÃÆÀ  ¶¥Ò»Ï£¬¸Ðл·ÖÏí£¡
2014-01-08 23:01   »Ø¸´  
ÎåÐÇºÃÆÀ  ¶¥Ò»Ï£¬¸Ðл·ÖÏí£¡
njgreencard11Â¥
2014-01-09 01:42   »Ø¸´  
ÎåÐÇºÃÆÀ  ¶¥Ò»Ï£¬¸Ðл·ÖÏí£¡
wtiger12Â¥
2014-01-09 07:49   »Ø¸´  
ÎåÐÇºÃÆÀ  ¶¥Ò»Ï£¬¸Ðл·ÖÏí£¡
clw57113Â¥
2014-01-09 07:55   »Ø¸´  
ÎåÐÇºÃÆÀ  ¶¥Ò»Ï£¬¸Ðл·ÖÏí£¡
fengcanluoye14Â¥
2014-01-09 10:47   »Ø¸´  
ÎåÐÇºÃÆÀ  ¶¥Ò»Ï£¬¸Ðл·ÖÏí£¡
¡î ÎÞÐǼ¶ ¡ï Ò»ÐǼ¶ ¡ï¡ï¡ï ÈýÐǼ¶ ¡ï¡ï¡ï¡ï¡ï ÎåÐǼ¶
×î¾ßÈËÆøÈÈÌûÍÆ¼ö [²é¿´È«²¿] ×÷Õß »Ø/¿´ ×îºó·¢±í
[¿¼ÑÐ] 320·Ö£¬²ÄÁÏÓ뻯¹¤×¨Òµ£¬Çóµ÷¼Á +7 Ò»¶¨Éϰ¶aaa 2026-03-27 9/450 2026-03-28 07:07 by wangy0907
[¿¼ÑÐ] 330Ò»Ö¾Ô¸Öйúº£Ñó´óѧ »¯Ñ§¹¤³Ì 085602 ÓжÁ²©ÒâÔ¸ Çóµ÷¼Á +3 wywy.. 2026-03-27 4/200 2026-03-28 03:32 by fmesaito
[¿¼ÑÐ] Ò»Ö¾Ô¸¹þ¶û±õ¹¤Òµ´óѧ²ÄÁÏÓ뻯¹¤·½Ïò336·Ö +6 ³½ãå5211314 2026-03-26 6/300 2026-03-28 03:31 by fmesaito
[¿¼ÑÐ] 266Çóµ÷¼Á +11 ÑôÑôÍÛÈû 2026-03-27 12/600 2026-03-27 17:56 by yu221
[¿¼ÑÐ] 292Çóµ÷¼Á +13 ¶ì¶ì¶ì¶î¶î¶î¶î¶ 2026-03-25 14/700 2026-03-27 15:40 by caszguilin
[¿¼ÑÐ] ²ÄÁÏÓ뻯¹¤£¨0856£©304ÇóBÇøµ÷¼Á +7 Çñgl 2026-03-27 7/350 2026-03-27 15:27 by JoeÂÊ
[¿¼ÑÐ] 279 ·Ö Çóµ÷¼Á +4 ˯¸öºÃ¾õ_16 2026-03-24 4/200 2026-03-27 15:05 by ×íÔÚ·çÀï
[¿¼ÑÐ] 329Çóµ÷¼Á +7 Å¥¶÷Ñ© 2026-03-25 7/350 2026-03-27 04:28 by wxiongid
[¿¼ÑÐ] 321Çóµ÷¼Á +5 ²ÄÁÏcailiao 2026-03-21 5/250 2026-03-26 20:41 by fmesaito
[¿¼ÑÐ] 329Çóµ÷¼Á +5 1() 2026-03-22 5/250 2026-03-26 20:40 by fmesaito
[¿¼ÑÐ] ¡¾Ë«Ò»Á÷ԺУÐÂÄÜÔ´¡¢»·¾³²ÄÁÏ£¬²ÄÁϼӹ¤ÓëÄ£ÄâÕÐÊÕ´óÁ¿µ÷¼Á¡¿ +4 Higraduate 2026-03-22 8/400 2026-03-26 20:34 by Higraduate
[¿¼ÑÐ] 081200-11408-276ѧ˶Çóµ÷¼Á +3 ´Þwj 2026-03-26 3/150 2026-03-26 19:57 by nihaoar
[¿¼ÑÐ] ²ÄÁÏÓ뻯¹¤304ÇóBÇøµ÷¼Á +3 Çñgl 2026-03-26 6/300 2026-03-26 18:03 by Çñgl
[¿¼ÑÐ] 085602 289·ÖÇóµ÷¼Á +8 WWWÎ÷Î÷¸¥Ë¹ 2026-03-24 8/400 2026-03-26 16:33 by ²»³Ôô~µÄ؈
[¿¼ÑÐ] 081700 µ÷¼Á 267·Ö +11 ÃÔÈ˵Ĺþ¹þ 2026-03-23 11/550 2026-03-26 15:41 by zzll406
[¿¼ÑÐ] 332Çóµ÷¼Á +6 032500 2026-03-25 6/300 2026-03-25 22:45 by 418490947
[¿¼ÑÐ] 0854µç×ÓÐÅÏ¢Çóµ÷¼Á +7 ¦Á____ 2026-03-22 9/450 2026-03-25 13:37 by ¦Á____
[»ù½ðÉêÇë] Çë½ÌÏ´ó¼Ò 2026Äê¹ú¼Ò»ù½ðÉêÇëÊÇ˫äÉóÂ𣿠+3 lishucheng1 2026-03-22 5/250 2026-03-24 08:22 by gltch
[¿¼ÑÐ] ¿¼Ñе÷¼Á +3 ºôºô£¿~+123456 2026-03-21 3/150 2026-03-21 20:04 by Î޼ʵIJÝÔ­
[¿¼ÑÐ] ²ÄÁÏÓ뻯¹¤£¨0856£©304Çó BÇø µ÷¼Á +3 Çñgl 2026-03-21 3/150 2026-03-21 13:47 by lature00
ÐÅÏ¢Ìáʾ
ÇëÌî´¦ÀíÒâ¼û