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金币: 84
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在线: 24.2小时
虫号: 1339858
注册: 2011-07-07
专业: 电工材料特性及其应用

[求助] 关于《MICROELECTRONIC ENGINEERING》

小弟初次投稿，选择了投此期刊，编辑给了两个review的意见，大牛们帮忙看下这评价如何？算是大修还是小修？希望大么？

Reviewer #1: The authors may present a new issue and a topic but there is no clear description on what is a new approach or a new result. SPER (Self-propagating exothermic reaction) was already reported and there are many papers published on SPER as the authors described. For example the authors describe previously reported results and facts by referring literatures in Introduction. However, it is not clear what is new. On lines from 2 to 12 in page 4 the authors intend to describe what is new. But are Cu/Cu joints new? Cu/Cu joints seems to be not new. If they think they are new, they should explain that. On the other hand, SPER process using Al/Ni is not new. In lines from 2 to 5, "there are little work reporting the in-depth understanding of solder behaviour and the joinning mechanism of SPER process", but there is no description in lines from 6 to 12 on Page 4.

As well as to revise the sentences in such a way the reasedrs can understand what is new, the authors revise the results and discussion on their experimental results. The expression on authors of References are lack coherence. It is better to see the authors guides of Microelectronic Engineering.

Reviewer #2: A systematic work to show how SPER can be beneficial to improve Al/Ni multilayer films bonding. I think the material is good enough to get publish as is if the conclusions are based on statistical analysis. So I would recommend the authors add more data to be able to draw conclusion based on statistical analysis. Especially Fig 6 and 7 tell us that there are correlations between pressure/temperature and thickness. But it is hard to clearly address if 0.5MPa is the critical pressure or not without statistical analysis. Since beneficiary of this work would be package or BEOL engineers, a conclusion based on statistical analysis is extremely important.

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