| 查看: 1555 | 回复: 9 | ||
| 【奖励】 本帖被评价9次，作者思念风的雨增加金币 8 个 | ||
| 当前主题已经存档。 | ||
| 当前只显示满足指定条件的回帖，点击这里查看本话题的所有回帖 | ||
[资源]
Solder Joint Technology: Materials, Properties, and Reliability
|
||
|
Solder Joint Technology: Materials, Properties, and Reliability (Springer Series in Materials Science) (Springer Series in Materials Science) By King-Ning Tu * Publisher: Springer * Number Of Pages: 386 * Publication Date: 2007-08-22 * ISBN-10 / ASIN: 0387388907 * ISBN-13 / EAN: 9780387388908 * Binding: Hardcover Product Description: Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed. http://rapidshare.com/files/75102375/Solder_Joint_Technology_Springer2007_.rar.html |
回复此楼» 猜你喜欢
307分材料专业求调剂
已经有6人回复
-
材料专硕283求调剂
已经有14人回复
-
327求调剂
已经有3人回复
-
计算机11408，286分求调剂
已经有6人回复
-
材料调剂
已经有14人回复
-
一志愿南昌大学，085600，344分求调剂
已经有3人回复
-
考研调剂生寻找导师
已经有3人回复
-
材料0856 英一数二 323 求调剂
已经有14人回复
-
308求调剂
已经有5人回复
-
化学0703-一志愿211-338分求调剂
已经有7人回复
5楼2007-12-11 00:50:41
4楼2007-12-10 14:54:03
6楼2008-01-10 17:40:37
简单回复
ycwbycwb2楼
2007-12-09 07:50
回复
