| 查看: 1556 | 回复: 9 | |||
| 【奖励】 本帖被评价9次，作者思念风的雨增加金币 8 个 | |||
| 当前主题已经存档。 | |||
[资源]
Solder Joint Technology: Materials, Properties, and Reliability
|
|||
|
Solder Joint Technology: Materials, Properties, and Reliability (Springer Series in Materials Science) (Springer Series in Materials Science) By King-Ning Tu * Publisher: Springer * Number Of Pages: 386 * Publication Date: 2007-08-22 * ISBN-10 / ASIN: 0387388907 * ISBN-13 / EAN: 9780387388908 * Binding: Hardcover Product Description: Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed. http://rapidshare.com/files/75102375/Solder_Joint_Technology_Springer2007_.rar.html |
回复此楼» 猜你喜欢
工科08-机械专硕-求调剂
已经有3人回复
-
一志愿苏州大学材料工程（085601）专硕有科研经历三项国奖两个实用型专利一项省级立项
已经有9人回复
-
材料工程302分求调剂
已经有8人回复
-
315求调剂
已经有14人回复
-
307分材料专业求调剂
已经有7人回复
-
材料调剂
已经有11人回复
-
262求调剂
已经有6人回复
-
一志愿北京交通大学材料工程总分358求调剂
已经有4人回复
-
一志愿青科085500，初试295分，公共课213分
已经有3人回复
-
304求调剂
已经有3人回复
4楼2007-12-10 14:54:03
5楼2007-12-11 00:50:41
6楼2008-01-10 17:40:37
7楼2008-01-10 21:32:53
简单回复
ycwbycwb2楼
2007-12-09 07:50
回复
2007-12-10 00:38
回复
