| 查看: 4097 | 回复: 42 | ||
| 【奖励】 本帖被评价34次，作者mooncold增加金币 27 个 | ||
| 当前主题已经存档。 | ||
[资源]
光电材料2007年新书
|
||
|
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume 1 Materials Physics / Materials Mechanics. ... Physical Design / Reliability and Packaging By Ephraim Suhir, Y.C. Lee, C.P. Wong -------------------------------------------------------------------------------- Publisher: Springer Number Of Pages: 1530 Publication Date: 2007-05-29 下载地址： http://rapidshare.com/files/7199 ... _and_Structures.rar -------------------------------------------------------------------------------- Product Description: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions. Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book. Topics addressed in the book include, but are not limited to, the following: physics and mechanics of polymer materials; underfills; electrically conductive adhesives; plastic packages of IC devices; lead free solders; flip-chip packages; portable electronics; wirebond interconnects and metallurgical interconnections for harsh environments; reliability and stress testing and accelerated life testing; solder joint materials and technologies as well as lead-free solder materials and joints; reliability of mobile electronic products, photonic materials, optical fibers and active and passive optical components; thermal phenomena in micro- and opto-electronic systems and thermal stresses; adhesion problems and solutions; thin film materials, physics and mechanics; photorefractive materials and devices; nanomaterials and nanotechnology; multiphysics modeling and optimization technologies; experimental methods and techniques; testing methods and techniques, subjected to thermal loading, stress analyses of processed silicon wafers, and many others. The book is intended as a reference source and as a manual for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists. The book will be an essential tool for all those who are involved or interested in state-of-the-art in the analysis, design and manufacturing of micro- and opto-electronic systems. |
回复此楼» 猜你喜欢
不自信的我
已经有10人回复
-
磺酰氟产物，毕不了业了！
已经有8人回复
-
求助:我三月中下旬出站，青基依托单位怎么办？
已经有10人回复
-
26申博（荧光探针方向，有机合成）
已经有4人回复
-
要不要辞职读博？
已经有3人回复
-
论文终于录用啦！满足毕业条件了
已经有26人回复
-
2026年机械制造与材料应用国际会议 （ICMMMA 2026）
已经有4人回复
-
Cas 72-43-5需要30g，定制合成，能接单的留言
已经有8人回复
-
北京211副教授，35岁，想重新出发，去国外做博后，怎么样？
已经有8人回复
-
自荐读博
已经有3人回复
» 本主题相关商家推荐: (我也要在这里推广)
2楼2007-11-26 06:28:49
4楼2007-11-26 21:46:21
5楼2007-11-27 00:16:11
6楼2007-11-27 15:20:44
7楼2007-11-27 15:21:33
8楼2007-11-27 16:10:28
9楼2007-11-27 18:22:59
10楼2007-11-27 19:29:48
11楼2007-12-02 16:04:18
12楼2007-12-04 10:33:53
13楼2008-02-23 11:54:28
14楼2008-02-23 16:29:00
15楼2008-02-28 16:02:53
16楼2008-03-14 21:02:02
17楼2008-03-15 15:44:47
18楼2008-03-15 17:14:32
19楼2008-05-11 21:50:38
|
本帖内容被屏蔽 |
20楼2008-05-15 09:38:23
21楼2008-05-18 11:22:03
22楼2008-05-18 14:45:02
23楼2008-06-04 10:18:41
24楼2008-06-04 17:04:39
25楼2008-07-09 00:30:50
26楼2008-07-09 08:40:26
27楼2008-09-10 11:18:54
28楼2008-11-07 22:37:24
29楼2008-11-08 09:43:49
简单回复
Block3楼
2007-11-26 10:00
回复
