| 查看: 5263 | 回复: 42 | ||
| 【奖励】 本帖被评价34次，作者mooncold增加金币 27 个 | ||
| 当前主题已经存档。 | ||
| 当前只显示满足指定条件的回帖，点击这里查看本话题的所有回帖 | ||
[资源]
光电材料2007年新书
|
||
|
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume 1 Materials Physics / Materials Mechanics. ... Physical Design / Reliability and Packaging By Ephraim Suhir, Y.C. Lee, C.P. Wong -------------------------------------------------------------------------------- Publisher: Springer Number Of Pages: 1530 Publication Date: 2007-05-29 下载地址： http://rapidshare.com/files/7199 ... _and_Structures.rar -------------------------------------------------------------------------------- Product Description: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions. Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book. Topics addressed in the book include, but are not limited to, the following: physics and mechanics of polymer materials; underfills; electrically conductive adhesives; plastic packages of IC devices; lead free solders; flip-chip packages; portable electronics; wirebond interconnects and metallurgical interconnections for harsh environments; reliability and stress testing and accelerated life testing; solder joint materials and technologies as well as lead-free solder materials and joints; reliability of mobile electronic products, photonic materials, optical fibers and active and passive optical components; thermal phenomena in micro- and opto-electronic systems and thermal stresses; adhesion problems and solutions; thin film materials, physics and mechanics; photorefractive materials and devices; nanomaterials and nanotechnology; multiphysics modeling and optimization technologies; experimental methods and techniques; testing methods and techniques, subjected to thermal loading, stress analyses of processed silicon wafers, and many others. The book is intended as a reference source and as a manual for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists. The book will be an essential tool for all those who are involved or interested in state-of-the-art in the analysis, design and manufacturing of micro- and opto-electronic systems. |
回复此楼» 猜你喜欢
静等基金结果
已经有18人回复
-
澳大利亚 Murdoch University 全奖博士招生（3个名额）地质化工冶金领域
已经有14人回复
-
阿姨
已经有3人回复
-
有时候，自然基金真的不能太认真 （我的申报经验）
已经有6人回复
-
filecode
已经有16人回复
-
重要来源：本周末出结果
已经有10人回复
-
欢迎发来filecode的Mz6后的代码验证其规律
已经有11人回复
-
咱们一起用铁证分析2026国家社科基金中标与否
已经有6人回复
-
不应该看fileCode
已经有9人回复
-
Filecode 又变了，巨变
已经有4人回复
» 本主题相关商家推荐: (我也要在这里推广)
22楼2008-05-18 14:45:02
2楼2007-11-26 06:28:49
5楼2007-11-27 00:16:11
7楼2007-11-27 15:21:33
