| 查看: 1074 | 回复: 18 | ||
| 【奖励】 本帖被评价12次，作者学员2bQ2PZ增加金币 8.5 个 | ||
| 当前主题已经存档。 | ||
| 当前只显示满足指定条件的回帖，点击这里查看本话题的所有回帖 | ||
[资源]
Ceramic Interconnect Technology Handbook
|
||
|
Ceramic Interconnect Technology Handbook By III, Fred D. Barlow, Aicha Elshabini * Publisher: CRC * Number Of Pages: 456 * Publication Date: 2007-01-24 * ISBN-10 / ASIN: 0849335574 * ISBN-13 / EAN: 9780849335570 * Binding: Hardcover Book Description: Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications. http://rapidshare.com/files/67147931/Ceramic_Interconnect_Technology_Handbook_0849335574.rar |
回复此楼» 猜你喜欢
211本科材料化工求调剂
已经有23人回复
-
山东省基金2026
已经有9人回复
-
一志愿华中农业071010，320求调剂
已经有5人回复
-
药学求调剂
已经有13人回复
-
求调剂推荐
已经有4人回复
-
290调剂生物0860
已经有40人回复
-
085400电子信息类（川大控制工程）求调剂可跨专业 求老师联系
已经有6人回复
-
材料工程281还有调剂机会吗
已经有42人回复
-
273求调剂
已经有6人回复
-
药学305求调剂
已经有6人回复
10楼2007-12-06 22:28:52
4楼2007-11-05 13:48:27
5楼2007-11-06 02:47:34
我也下不来呀。 6楼2007-11-06 07:53:19
