| 查看: 1088 | 回复: 18 | |||
| 【奖励】 本帖被评价12次，作者学员2bQ2PZ增加金币 8.5 个 | |||
| 当前主题已经存档。 | |||
[资源]
Ceramic Interconnect Technology Handbook
|
|||
|
Ceramic Interconnect Technology Handbook By III, Fred D. Barlow, Aicha Elshabini * Publisher: CRC * Number Of Pages: 456 * Publication Date: 2007-01-24 * ISBN-10 / ASIN: 0849335574 * ISBN-13 / EAN: 9780849335570 * Binding: Hardcover Book Description: Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications. http://rapidshare.com/files/67147931/Ceramic_Interconnect_Technology_Handbook_0849335574.rar |
回复此楼» 猜你喜欢
求博导｜生物质基多孔碳/超级电容方向，已有相关成果，寻能源材料/碳材料方向老师
已经有3人回复
-
二苯甲酮酸类衍生物
已经有6人回复
-
接受任何调剂
已经有4人回复
-
一志愿中科大材料与化工，353分还有调剂学校吗
已经有12人回复
-
320求调剂
已经有4人回复
-
一志愿华中农业071010，320求调剂
已经有18人回复
-
295分求调剂
已经有5人回复
-
294求调剂
已经有8人回复
-
山东双非院校考核超级无底线，领导幸灾乐祸，教师遭殃恐
已经有8人回复
-
0854求调剂
已经有25人回复
2楼2007-11-04 12:22:53
3楼2007-11-04 15:19:12
4楼2007-11-05 13:48:27
5楼2007-11-06 02:47:34
6楼2007-11-06 07:53:19
7楼2007-11-09 09:55:29
8楼2007-11-11 17:36:49
9楼2007-11-11 23:33:18
10楼2007-12-06 22:28:52
11楼2007-12-07 10:54:05
12楼2008-02-12 23:25:33
13楼2008-02-15 23:12:14
50