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Product Information
Introduction to Thermoelectrics.........................................................................................................................................................1
Structure and Function......................................................................................................................................................................2
Temperature Control.........................................................................................................................................................................4
Parameters Required for Device Selection.........................................................................................................................................6
Sealant Options.................................................................................................................................................................................7
Thermoelectric Arrays........................................................................................................................................................................7
Design/Selection Checklist................................................................................................................................................................8
Thermoelectric Multistage (Cascade) Modules .................................................................................................................................9
Typical Device Performance...............................................................................................................................................................9
Assembly Information
Assembly Tips..................................................................................................................................................................................10
Procedure For Assembling Lapped Modules To Heat Exchangers....................................................................................................11
Procedure For Assembling Solderable Modules To Heat Exchangers...............................................................................................12
Performance and Properties
Device Performance Formulae.........................................................................................................................................................13
Heat Transfer Formulae...................................................................................................................................................................14
Typical Properties of Materials (@ 21¡ãC)........................................................................................................................................15
Reliability & Mean Time Between Failures (MTBF)......................................................................................................................................16

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Product Information
Introduction to Thermoelectrics.........................................................................................................................................................1
Structure and Function......................................................................................................................................................................2
Temperature Control.........................................................................................................................................................................4
Parameters Required for Device Selection.........................................................................................................................................6
Sealant Options.................................................................................................................................................................................7
Thermoelectric Arrays........................................................................................................................................................................7
Design/Selection Checklist................................................................................................................................................................8
Thermoelectric Multistage (Cascade) Modules .................................................................................................................................9
Typical Device Performance...............................................................................................................................................................9
Assembly Information
Assembly Tips..................................................................................................................................................................................10
Procedure For Assembling Lapped Modules To Heat Exchangers....................................................................................................11
Procedure For Assembling Solderable Modules To Heat Exchangers...............................................................................................12
Performance and Properties
Device Performance Formulae.........................................................................................................................................................13
Heat Transfer Formulae...................................................................................................................................................................14
Typical Properties of Materials (@ 21¡ãC)........................................................................................................................................15
Reliability & Mean Time Between Failures (MTBF)......................................................................................................................................16
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