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¡¶Thermoelectric_Handbook¡· Ŀ¼ Product Information Introduction to Thermoelectrics.........................................................................................................................................................1 Structure and Function......................................................................................................................................................................2 Temperature Control.........................................................................................................................................................................4 Parameters Required for Device Selection.........................................................................................................................................6 Sealant Options.................................................................................................................................................................................7 Thermoelectric Arrays........................................................................................................................................................................7 Design/Selection Checklist................................................................................................................................................................8 Thermoelectric Multistage (Cascade) Modules .................................................................................................................................9 Typical Device Performance...............................................................................................................................................................9 Assembly Information Assembly Tips..................................................................................................................................................................................10 Procedure For Assembling Lapped Modules To Heat Exchangers....................................................................................................11 Procedure For Assembling Solderable Modules To Heat Exchangers...............................................................................................12 Performance and Properties Device Performance Formulae.........................................................................................................................................................13 Heat Transfer Formulae...................................................................................................................................................................14 Typical Properties of Materials (@ 21¡ãC)........................................................................................................................................15 Reliability & Mean Time Between Failures (MTBF)......................................................................................................................................16 |
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