| 查看: 3785 | 回复: 65 | ||||||||||
| 【奖励】 本帖被评价59次，作者zhouwenbin7增加金币 46.8 个 | ||||||||||
| 当前只显示满足指定条件的回帖，点击这里查看本话题的所有回帖 | ||||||||||
[资源]
分享热电两大红宝书，Introduction to Thermoelectricity 和 Thermoelectric_Handbook
|
||||||||||
 分享热电两大红宝书，方便全面了解这一领域。收集不易，忘大家珍惜，仅用于学术交流，切勿商用~本人现在在做热电方向，入门菜鸟，欢迎大家交流学习 《Thermoelectric_Handbook》 目录Product Information Introduction to Thermoelectrics.........................................................................................................................................................1 Structure and Function......................................................................................................................................................................2 Temperature Control.........................................................................................................................................................................4 Parameters Required for Device Selection.........................................................................................................................................6 Sealant Options.................................................................................................................................................................................7 Thermoelectric Arrays........................................................................................................................................................................7 Design/Selection Checklist................................................................................................................................................................8 Thermoelectric Multistage (Cascade) Modules .................................................................................................................................9 Typical Device Performance...............................................................................................................................................................9 Assembly Information Assembly Tips..................................................................................................................................................................................10 Procedure For Assembling Lapped Modules To Heat Exchangers....................................................................................................11 Procedure For Assembling Solderable Modules To Heat Exchangers...............................................................................................12 Performance and Properties Device Performance Formulae.........................................................................................................................................................13 Heat Transfer Formulae...................................................................................................................................................................14 Typical Properties of Materials (@ 21°C)........................................................................................................................................15 Reliability & Mean Time Between Failures (MTBF)......................................................................................................................................16 Introduction to Thermoelectricity 目录，截图如下：  目录1.jpg  目录2.jpg  目录3.jpg [ Last edited by zhouwenbin7 on 2013-5-14 at 20:06 ] |
回复此楼» 本帖附件资源列表
-
欢迎监督和反馈：小木虫仅提供交流平台，不对该内容负责。
本内容由用户自主发布，如果其内容涉及到知识产权问题，其责任在于用户本人，如对版权有异议，请联系邮箱：xiaomuchong@tal.com - 附件 1 : IntroductiontoThermoelectricity.part1.rar
- 附件 2 : IntroductiontoThermoelectricity.part2.rar
- 附件 3 : IntroductiontoThermoelectricity.part3.rar
- 附件 4 : IntroductiontoThermoelectricity.part4.rar
- 附件 5 : IntroductiontoThermoelectricity.part5.rar
- 附件 6 : IntroductiontoThermoelectricity.part6.rar
- 附件 7 : Thermoelectric_Handbook.pdf
2013-05-13 10:56:53, 8 M
2013-05-13 10:57:05, 8 M
2013-05-13 10:57:17, 8 M
2013-05-13 10:57:31, 8 M
2013-05-13 10:57:39, 8 M
2013-05-13 10:57:46, 5.92 M
2013-05-13 10:58:52, 2.38 M
» 收录本帖的淘帖专辑推荐
 国外专业电子书2 | 光学工程新思想 | 我喜爱的材料类书籍 | 淘贴集 |
| 纳米材料（MECHANISM) | 热电材料 | 博士后生活 | 【未分类】 |
» 猜你喜欢
无机化学论文润色/翻译怎么收费?
已经有91人回复
34楼2014-03-23 13:51:25
kunpeng1782: 回帖置顶 2013-05-14 11:48:48
|
《Thermoelectric_Handbook》 目录 Product Information Introduction to Thermoelectrics.........................................................................................................................................................1 Structure and Function......................................................................................................................................................................2 Temperature Control.........................................................................................................................................................................4 Parameters Required for Device Selection.........................................................................................................................................6 Sealant Options.................................................................................................................................................................................7 Thermoelectric Arrays........................................................................................................................................................................7 Design/Selection Checklist................................................................................................................................................................8 Thermoelectric Multistage (Cascade) Modules .................................................................................................................................9 Typical Device Performance...............................................................................................................................................................9 Assembly Information Assembly Tips..................................................................................................................................................................................10 Procedure For Assembling Lapped Modules To Heat Exchangers....................................................................................................11 Procedure For Assembling Solderable Modules To Heat Exchangers...............................................................................................12 Performance and Properties Device Performance Formulae.........................................................................................................................................................13 Heat Transfer Formulae...................................................................................................................................................................14 Typical Properties of Materials (@ 21°C)........................................................................................................................................15 Reliability & Mean Time Between Failures (MTBF)......................................................................................................................................16 |
2楼2013-05-13 13:05:26
3楼2013-05-13 13:09:16
简单回复
2013-05-15 12:36
回复
五星好评 顶一下，感谢分享！
yuan9996楼
2013-05-16 08:55
回复
五星好评 顶一下，感谢分享！
2013-05-19 01:46
回复
五星好评 顶一下，感谢分享！
2013-05-27 07:36
回复
五星好评 顶一下，感谢分享！
mateng_090210楼
2013-06-02 13:40
回复
五星好评 顶一下，感谢分享！
jtkdpangzi11楼
2013-06-02 15:22
回复
五星好评 顶一下，感谢分享！
xmmec12楼
2013-06-05 17:02
回复
五星好评 顶一下，感谢分享！
gongxd32513楼
2013-06-26 19:29
回复
五星好评 顶一下，感谢分享！
gengxin6014楼
2013-06-26 21:52
回复
顶一下，感谢分享！