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【2012-8-15】The 1st International Conference on ALD Applications & 2nd Chin
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https://mse.fudan.edu.cn/nanomembrane/c-ald/ The 1st International Conference on ALD Applications & 2nd China ALD conference will be a two-day meeting, dedicated to the fundamental, materials, and applications of Atomic Layer Deposition (ALD) technology. It will be held in Shanghai, China, from October 15 to 16, 2012. Following the success of the 1st China ALD Scientific Meeting in 2010, the 2nd China ALD 2012 conference will feature plenary sessions, poster sessions and an industrial exhibition. Papers submitted by students will be eligible for the "Best Student PaperAwards". Atomic Layer Deposition is applied in numerous advanced technologies including microelectronics, nanotechnology, MEMS/NEMS, and green energy technology that require precise control of film properties in thickness, uniformity, and comformality etc. In microelectronics, ALD has established its applications in e.g. high dielectric constant (high-k) films for MOS devices, metal nanocrystals for memory devices, and ultrathin diffusion barriers for Cu interconnects. ALD is also receiving great attention for its potential application in solar energy, organic electronics, catalysis, micro-systems and biological applications. A unique attribute of ALD is the use of sequential self-limiting surface reactions to achieve conformal films with sub-monolayer thickness control. This conference will cover all aspects of ALD: * ALD Precursors and Precursor Design * Simulation, Modeling, and Theory of ALD * ALD Surface Chemistry * Surface Preparation for ALD * Initiation of ALD Growth * Patterned and Selective Area ALD * In-situ Monitoring and Analysis * Radical, Plasma and Other Energy-Enhanced ALD Methods * Equipment and Manufacturing * Applications of ALD for Microelectronics and Nanotechnology * ALD for MEMS * ALD for Catalytic, Photovoltaic, Optical, Magnetic Materials * Characterization of ALD Coatings * Devices Formed Using ALD Materials IMPORTANT DATES August 15, 2012—Abstract Submission Ends September 20, 2012—Preregistration Opens Please submit your abstract for Oral or Poster presentation to the Organization Committee ORGANIZING COMMITTEE CO-CHAIRS Prof. Shi-Jin Ding, Fudan University (sjding@fudan.edu.cn) Prof. Yongfeng Mei, Fudan University (yfm@fudan.edu.cn) Mr. Stephen Liu (CEO), Honoprof Ltd. CONFERENCE COMMITTEE & INVITED SPEAKERS Prof. DavidWei Zhang, Fudan University (Co-chair) Dr. Wei-Min Li, Picosun Ltd. (Co-chair) Prof. Mikko Ritala, University of Helsinki Prof. Peide Ye, Purdue University Prof. Markku Leskela, University of Helsinki Prof. Minghwei Hong, National Taiwan University Prof. RobertWallace, University of Texas at Dallas Prof. Mato Knez, Nanoscience Cooperative Research Center, Spain Prof. Hongjin Fan, Nanyang Technological University, Singapore PROCEEDING AND FULL PAPER: Full contributed papers will be peer reviewed and published in a special issue Nanoscale Research Letters (2011 impact factor: 2.557). VENUE AND ACCOMMODATION: Fuxuan Hotel, Guoding Road 400, Shanghai, China Tel.: +86-(0)21-55589518 https://mse.fudan.edu.cn/nanomembrane/c-ald/ [ Last edited by gshuang on 2012-7-5 at 15:17 ] |
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