| ²é¿´: 765 | »Ø¸´: 1 | ||
| ±¾Ìû²úÉú 1 ¸ö ·ÒëEPI £¬µã»÷ÕâÀï½øÐв鿴 | ||
LLNN2010½ð³æ (³õÈëÎÄ̳)
|
[ÇóÖú]
ÕÒÈË·ÒëÕªÒª¡¾ÖÐÒëÓ¢¡¿
|
|
|
×î½üдµÄһϵÁеÄÎÄÕÂÖ®Ò»£¬×¼±¸ÊÔͶ¸öAÀàÆÚ¿¯£¬Çó´ïÈ˰ïæ·ÒëÌâÄ¿ºÍÕªÒª°É£¬Ð»Ð»À² ¡¾ÌâÄ¿¡¿ËáÐÔ½éÖÊÖеÍŨ¶ÈÍÀë×ӵĵç³Á»ýÑо¿ ¡¾ÕªÒª¡¿±¾ÎĶÔËáÐÔ½éÖÊÖеÍŨ¶ÈÍÀë×ÓÔÚ²¬µç¼«Éϵĵç³Á»ý¹ý³Ì½øÐÐÑо¿¡£Ê×ÏÈ£¬¶ÔÆÕͨŨ¶ÈÍÀë×Ӻ͵ÍŨ¶ÈÍÀë×ÓÔÚ²¬µç¼«Éϵĵ绯ѧÐÐΪ¹ý³Ì¾ÐÐÁ˼òÒª²ûÊö£¬·ÖÎöÁ˲»Í¬µçλɨÃèËÙ¶ÈÏÂÍÀë×Óµç³Á»ý¹ý³ÌÖеı仯¡£È»ºó£¬¶Ô²»Í¬Å¨¶ÈÍÀë×ӵĵç³Á»ý¹ý³Ì½øÐÐÑо¿£¬½«ÆäÇúÏß½øÐзֽ׶ÎÌÖÂÛ£¬·ÖÎöµç³Á»ý¹ý³ÌÖи÷¸ö½×¶ÎµÄÍÀë×Ó·´Ó¦±ä»¯µÈÇé¿ö¡£×îºó£¬Í¨¹ýÓйصÄʵÑéÊý¾Ý£¬½øÐпɹ۵ĸ´ÔÓÔËË㣬²¢Ê¹Óõõ½µÄ½á¹û½¨Á¢ÁËÒ»¸öµÍŨ¶ÈÍÀë×ӵ绹ԳÁ»ýµÄ¼òµ¥¹ý³ÌÄ£ÐÍ¡£ ×îºó£¬×£µã»÷ºÍ·ÒëµÄÈËãØ¼ÒÐÒ¸££¬Ôªµ©¿ìÀÖ [ Last edited by LLNN2010 on 2011-12-29 at 10:07 ] |
» ²ÂÄãϲ»¶
265Çóµ÷¼Á
ÒѾÓÐ6È˻ظ´
²ÄÁÏÇóµ÷¼Á
ÒѾÓÐ13È˻ظ´
Ò»Ö¾Ô¸Ö£ÖÝ´óѧ²ÄÁÏÓ뻯¹¤085600£¬Çóµ÷¼Á
ÒѾÓÐ26È˻ظ´
070300»¯Ñ§279Çóµ÷¼Á
ÒѾÓÐ18È˻ظ´
²ÄÁϵ÷¼Á
ÒѾÓÐ8È˻ظ´
»¯¹¤Çóµ÷¼Á£¡
ÒѾÓÐ6È˻ظ´
290Çóµ÷¼Á085701
ÒѾÓÐ11È˻ظ´
085600²ÄÁÏÓ뻯¹¤×¨Ë¶329 Çóµ÷¼Á
ÒѾÓÐ6È˻ظ´
295Çóµ÷¼Á
ÒѾÓÐ15È˻ظ´
Ò»Ö¾Ô¸ºÓ±±¹¤Òµ´óѧ²ÄÁϹ¤³Ì£¬³õÊÔ344Çóר˶µ÷¼Á
ÒѾÓÐ6È˻ظ´
terry_well
ÈÙÓþ°æÖ÷ (ÖªÃû×÷¼Ò)
Ц°¾½¬ºý¡ª¡ªÂúÄÔ½¬ºý
- ·ÒëEPI: 160
- Ó¦Öú: 207 (´óѧÉú)
- ¹ó±ö: 1.508
- ½ð±Ò: 3769.8
- É¢½ð: 9654
- ºì»¨: 229
- ɳ·¢: 11
- Ìû×Ó: 5857
- ÔÚÏß: 601.1Сʱ
- ³æºÅ: 352600
- ×¢²á: 2007-04-22
- ÐÔ±ð: GG
- רҵ: ȼÉÕѧ
- ¹ÜϽ: ÁôѧÉú»î
¡¾´ð°¸¡¿Ó¦Öú»ØÌû
¡ï
sltmac(½ð±Ò+1): 2011-12-29 18:51:22
LLNN2010(½ð±Ò+100, ·ÒëEPI+1): ¡ï¡ï¡ï¡ï¡ï×î¼Ñ´ð°¸ iron£¬accoding£¬finnalyÈý¸öƴдС´íÎó£¬ºÇºÇ 2011-12-29 19:10:48
LLNN2010: »ØÌûÖö¥ 2011-12-29 20:20:55
sltmac(½ð±Ò+1): 2011-12-29 18:51:22
LLNN2010(½ð±Ò+100, ·ÒëEPI+1): ¡ï¡ï¡ï¡ï¡ï×î¼Ñ´ð°¸ iron£¬accoding£¬finnalyÈý¸öƴдС´íÎó£¬ºÇºÇ 2011-12-29 19:10:48
LLNN2010: »ØÌûÖö¥ 2011-12-29 20:20:55
|
Title: the study on electrodeposition of copper ions from its low concentration acid medium Abstract: In this paper, copper iron electrodeposition process on platinum electrode in a low concentration of acidic medium was experimentally investigated. First, it was clarified that the process about the electrochemical behavior of copper ions on platinum electrode in general concentration and low concentration solution, in which how the different potential scan rates of copper ion deposition process changes was also analyzed. Then, the electrodeposition process of copper ions in different concentrations solutions was studied, and it was discussed accoding to the stages of their curves, including a analysis of electro-deposition process of copper ions in various stages of the reaction and changes in circumstances. Finally, based on the experimental data, after some considerable complexity of operations and consideration of the results obtained, a low concentration of copper ion deposition to restore the simple process model was finnaly established. ½ö¹©²Î¿¼¡£ |

2Â¥2011-12-29 18:20:50














»Ø¸´´ËÂ¥