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luovincent

银虫 (小有名气)


[交流] 【翻译求助】请帮忙翻译一篇摘要,中译英的,谢谢

摘要正文如下:
       由于集成电路集成度的提高和广泛应用,其信号传输频率越来越高,因而在PCB导线中信号传输(或信号处理)速度也随之迅速提高,这就对特性阻抗控制提出了较高的要求。从特性阻抗理论公式和实际工作中发现,PCB产品的内层铜厚情况是影响其信号稳定的重要因素之一;同时内层铜薄问题更是影响PCB可靠性的主要因素。
       近年我司内部发现的内层铜薄问题频率明显上升,同时其大部分在我司内部的探测度低甚至无法探测,在成品PCB的处理难度极大。本课题将通过DOE实验方法对内层铜厚影响的各个控制点确认其影响程度,并建立有效的控制点和探测方法,阻截不合格品、分析原因并实施改善,最终达到对该项目的系统控制。

因为公司论文的要求,先谢谢各位啦!
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luovincent(金币+5, 翻译EPI+1):谢谢 2010-12-16 06:34:28
As integrated circuits are improved and used extensively, the signal transmission frequency increases. As a result, the signal transmission rate in the PCB (or signal processing) also rapidly increases. This causes a higher requirement for speciality impedance control.
2楼2010-12-15 20:32:08
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luovincent(金币+5):谢谢 2010-12-16 06:34:45
From the theoretical formula and practical work of characteristic impedance, the inner copper thickness of PCB product is an important factor to affect the signal stability; while the inner copper thickness is one of main cause of affecting the reliability.
3楼2010-12-15 20:39:10
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luovincent(金币+5):谢谢 2010-12-16 06:34:55
In recent years, we found the problems for a thin inner copper increased significantly, while most of they are even undetectable due to the low probe, so that it is very difficult to deal in the finished PCB process.
4楼2010-12-15 20:47:04
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luovincent(金币+5):谢谢 2010-12-16 06:35:01
The DOE method we used will carried out to test the effect extent of inner layer copper thickness for each control point, establish effective control point and the probe method, intercept unqualified products, analyze the causes and implement improvement, and control the systems of the project ultimately.
5楼2010-12-15 20:54:01
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