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南理工化院(金币+30, 翻译EPI+1): 2010-11-24 20:34:32
值得强调的是（值得注意的是），在化学镀（electroless plating）组分中，我们还添加了极其微量的EDTA。它的作用与它在传统化学镀过程中所起的的角色不完全相同。在传统化学镀液中，EDTA的作用主要是与镀液中的金属离子络合，以避免在碱性镀液中形成氢氧化物沉淀。而在本实验体系中，它所起的作用非常特殊（特别），我们可以把它当作是氢氧化物胶体的攻击剂。
It is worth emphasizing that extremely trace of EDTA was added in the compositions of electroless plating, the role of which is not identical to that in traditional electroless plating, in which EDTA was used to complex metal ions in the plating bath. However, in the present system, it was used as attack reagents of hydroxide colloid, which makes it very special. |
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