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mmsabina铁杆木虫 (正式写手)
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[交流]
半导体工艺一.
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Cathode Coatings(阴极涂层剂) 二.Conformal Coatings for Electronic Packaging (用于电子封装的保形涂料/涂层) 三.Electroplating chemical (电镀化学品) Electroplating chemical Cleaners(电镀化学清洗剂) Electroplating chemical—Electroless(电镀化学品-无电镀,化学镀,非电解镀) Electroplating chemical—Electrolytic(电镀化学品-电解液) 四.Encapsulants for Electronic Packaging(电子封装密封剂) Epoxies for Potting(用于封装的环氧树脂) High Purity Passivation Materials (高纯度钝化材料) Resistor Coatings(电阻涂料) Flip Chip Underfill(倒装晶片底层填料) Silicone for Potting and Encapsulation(用于封装和包封的硅酮) 五.Epoxy Adhesives(环氧粘合剂) Insulative Epoxy Adhesives(绝缘环氧树脂粘合剂) Conductive Adhesives(环氧树脂粘合剂) 六.Semiconductor and Thin Film Etchants for Microelectronic Circuits 用于微电子电路的半导体和薄膜蚀刻剂 七.SILICON NITRIDE ETCHING APPARATUS(氮化硅蚀刻仪器) 八.Photoresist Materials(光刻胶,其他译名:光致抗蚀剂\感光性树脂\光阻材料) 九.Printed Circuit Board Manufacturing Chemicals(印刷电路板制造化学品) 十.Semiconductor Materials(半导体材料) Cleaning and Polishing(清洗剂和抛光剂) Diffusants (扩散剂) Heat Sinks and Vacuum Oil (吸热油脂和真空油) Junction Coatings(结合涂料) 一.Cathode Coatings(阴极涂层剂) 1.Cathode Coatings For Thermal Electronic Emission(用于散热的阴极涂层剂) 2.Emission Carbonates Powder(散热二氧化碳粉末) 3.BINDERS FOR CATHODE COATINGS(阴极涂层粘结剂) 二.Conformal Coatings for Electronic Packaging(用于电子封装的保形涂料/涂层) 1.Silicoat?SILICONE COATING FOR PRINTED CIRCUIT ASSEMBLIES 用于印刷电路装配的硅酮保形涂料/涂层 2.Hybrisil?Conformal Coatings for Thin Film/Thick Film用于薄膜/厚膜的保形涂料/涂层 3.Q-Lac?Radio Frequency Dielectric LacquerRF射频绝缘漆 4.Resistor Coatings-High Temperature Conformal Coatings高温电阻器保形涂料/涂层 5.Radiation Curable Conformal Coating-辐射线固化保形涂料/涂层 三.Electroplating chemical (电镀化学品) Electroplating chemical Cleaners(电镀化学清洗剂) GOLD/SILVER CLEANER金, 银清洗剂 Electroplating chemical—Electroless(电镀化学品-无电镀,化学镀,非电解镀) 1.GOLD (Au) 金 A.Bright Electroless Gold (光亮无电镀金) B.IMMERSION GOLD CF-CYANIDE-FREE ELECTROLESS 浸液金CF(不含氰化物) 2.SILVER (Ag) 银 Electroless Silver (无电镀银) 3.TIN (Sn) 锡 Bright Electroless Tin (光亮无电镀锡) 4.COPPER (Cu) 铜 PCB Electroless Copper(印刷电路板无电镀铜) 5.NICKEL (Ni) 镍 A.Nickelex-Improved Electroless Nickel Plating Solution Ammonia Free (不含氨改良的无电镀镀镍解决方案) B.Electroless Nickel Plating Ammonia Type(formERLY ENPAT) (含氨的无电镀镀镍) C.Electroless Nickel Plating Strike-For Copper, Brass and Copper Alloys (无电镀镍触击电镀) D.Nickel - B-Special Electroless Nickel - Boron For High Electrical Conductivity and Oxidation Resistance (用于高电导和抗氧化的无电镀镀镍) 6.Plating on Non-Conductive Surfaces RTM Process-Room Temperature Metallizing For Alumina 导电面的电镀(氧化铝室温金属化) Electroplating chemical—Electrolytic(电镀化学品-电解液) 1.GOLD (Au) AND ALLOYS(金和合金) A.Special Gold-Room Temperature Metallizing For Alumina(氧化铝室温金属处理) B.TRANSENE SULFITE GOLD - TSG-250 (亚硫酸金) Gold Electroplating Solution for Electronic and Aerospace Applications(电子和宇航领域的镀金解决方案) 2.SILVER (Ag) 银 Standard Silver/High Speed Silver Electroplating Solutions(标准\高速镀银解决方案) 3.TIN-LEAD (100% Sn锡, 100% Pb铅, all alloy ratios合金) 锡-铅 Tin-Lead Plating Solutions(锡-铅电镀解决方案) 4.NICKEL (Ni) 镍 A.Watts Nickel Plating Solution High Quality General Purpose Nickel Plating Composition(高品质镀镍解决方案) B.Woods Nickel C. Sulfamate Nickel Plating SN-10 5.COPPER (Cu) 铜 Copper Plating Acid Type(镀铜酸) 四.Encapsulants for Electronic Packaging(电子封装密封剂) Epoxies for Potting(用于封装的环氧树脂) A.Epoxy 125/175/200/225 General Purpose Epoxies For Electronic Potting Applications(电子填充的通用环氧树脂) B.Epoxy Based Potting Compound XS-531(用灌注混合物XS-531制造的环氧树脂) C.Epotherm 130/180 Thermally Conductive Epoxy Compounds(环氧树脂Epotherm 130/180-导热环氧树脂) High Purity Passivation Materials (高纯度钝化材料) 1.SES-Low Viscosity Silicone Elastomer for Semiconductors (用于半导体的低粘性SES 硅酮弹性体) 2.SES Black -Modified Silicone Elastomer For Light Absorption (改良的吸光硅酮橡胶) 3.MBS?Moisture Barrier Silicone(防潮硅酮橡胶) 4.SSE?Self-Catalyzed Silicone Elastomer(自催化硅酮橡胶) Resistor Coatings(电阻涂料) A.Hybrisil?Conformal Coatings for Thin Film/Thick Film (用于薄膜/厚膜的保形涂料) B.Q-Lac?Radio Frequency Dielectric Lacquer(RF射频绝缘漆) C.Resistor Coatings-High Temperature Conformal Coatings(高温电阻保形涂料) Flip Chip Underfill(倒装晶片底层填料) Underfill 25-High Purity, Fast Curing Underfill Encapsulant高纯度快速固化包封剂 Silicone for Potting and Encapsulation(用于封装和包封的硅酮) 1.Translastic ? RTV Silicones Potting and Encapsulation of Electronic Components and Circuit Modules (电子元器件和电路模块填充和封装用硅酮) 2.Translastic RTV 1602 3.Translastic ? S-2007 Silicone Junction Coating For Rectifiers (硅酮半导体结涂料) 4.Semiconductor Junction Coating (半导体结涂层) Silicone Elastomer Systems for Protection and Passivation of Semiconductor Junctions (用于半导体结保护和钝化的硅酮橡胶) 5.Silicone Semi-GelTransparent Dielectric Potting(硅酮半凝胶) 6.Thermasil- Thermally Conductive Fire Retardant Silicone(导热防火硅酮) 7.Radiation Curable Encapsulant(辐射固化的包封剂) 8.Silicoat?SILICONE COATING FOR PRINTED CIRCUIT ASSEMBLIES (用于印刷电路装配的硅酮涂料) 五.Epoxy Adhesives(环氧粘合剂) Insulative Epoxy Adhesives(绝缘环氧树脂粘合剂) 1.Epoxy 13/14/15 Single Component High Viscosity单组分高粘性 Epoxy 13: Moisure Resistant防湿 Epoxy 14: Thermal Conductivity导热 Epoxy 15: High Peel高剥离 2.Epoxy 16/17 Two Component High Viscosity双组分高粘性 Epoxy 16: High Peel高剥离 Epoxy 17: High Peel; Thermal Conductivity高剥离, 导热 3.Optical Epoxy光环氧 Epoxy 20: Optical Clarity透光 Epoxy 30: Radiation Resistance防辐射 Epoxy 50: Adhesive Sealant粘合剂,密封剂 Conductive Adhesives(环氧树脂粘合剂) 1.Ohmex AG-Thermosetting Silver for Ohmic Bonding to Semiconductors (半导体阻焊热固性-银环氧树脂) 2.Silver Epoxy Paste-Screenable Thermosetting Silver for Ohmic Bonding(阻焊的屏蔽热固性-银环氧树脂) 3.Silver Met-Silver Metallizations for Non-Metals (用于非金属材料-银金属涂膜剂) 4.Silver Bond-Low Temperature Thermosetting Silver (低温热固性-银粘结剂) 5.Microcircuit Silver- for Conductive Bonding in Microelectronics (用于微电子导焊-微电路银) 6.Nanopoxy 60-Electrically Conductive Epoxy for Nanoscale Applications (导电纳米环氧树脂) 7.Gold Epoxy Paste-THERMOSETTING GOLD FOR OHMIC BONDING (阻焊的热固性-金环氧树脂) 8.Polymide Die Attach Adhesive (PDA) -Low Mobile Ion, Silver-filled Adhesive for IC Chip Bonding (聚酰亚胺膜粘结剂-用于集成电路芯片焊的填充粘合剂) 9.Surface Mount Adhesives (SMA) 表面贴装粘合剂 Low cost, high density packaging of integrated circuits, lead-less chip carriers, and chip component attachment for ceramic substrates and PC Boards (表面贴装粘合剂)- 用于陶瓷衬底和印刷电路的集成电路\无铅芯片载体\芯片元件附件低成本,高密度封装 10.Conductive Via Fill 6030导电孔道填充粘结剂 11.Radiation Curable Adhesive(防辐射粘合剂) 六.Semiconductor and Thin Film Etchants for Microelectronic Circuits 用于微电子电路的半导体和薄膜蚀刻剂 1.Aluminum Etchants for Aluminum Metallizations in Microelectronics 微电子中镀铝用的铝蚀刻剂 2.TRANSETCH-N-Selective Etchant for Gallium Nitride, Silicon Nitride or Aluminum Oxide Films 用于氮化镓,氮化硅,氧化铝薄膜的选择性蚀刻剂 3.Silicon Dioxide (SiO2) Etchants二氧化硅蚀刻剂 4.CHROMIUM ETCHANT铬蚀刻剂 5.Printed Circuit Copper Etchants印刷电路板铜蚀刻剂 6.GALLIUM ARSENIDE ETCHANTS砷化镓蚀刻剂 7.Gallium Phosphide Etchant For Light Emitting Diodes用于发光二级管的磷化镓蚀刻剂 8.Gold Etchants for Microelectronics Circuits用于微电子中的金蚀刻剂 9.Tin Oxide-Indium Tin Oxide Etchant TE-100氧化锡-氧化铟锡蚀刻剂 10.Iron Oxide Mask Etchant-Fabrication of Fe2O3 See-through Masks氧化铁掩模蚀刻剂 12.Kapton Polymide Film Etchant 13.Moly Etchant – TFM 14.Nichrome Etchants TFC and TFN镍铬合金蚀刻剂 14.Nickel Etchants For Thin Film Circuits薄膜电路镍蚀刻剂 15.NICKEL VANADIUM ETCHANT NiV 28-23镍钒蚀刻剂 16.Palladium Etchants Platinum Etchant钯蚀刻剂\铂蚀刻剂 17.Preferential Silicon Etchants选择硅蚀刻剂 18.Silver Etchant for Microelectronics Circuits用于微电子电路中的银蚀刻剂 19.TANTALUM ETCHANTS SIE-8607 and 111钽蚀刻剂 20.TITANIUM ETCHANTS钛蚀刻剂 21.Ti-Tungsten TiW-30钛钨蚀刻剂 22.Moly Etchant – TFM -Tungsten Etchant - TFW 23.Transene Semiconductor and Thin Film Etchants Selection Guide Transene 半导体和薄膜蚀刻剂选型指南 24.Transene Etchant/Metal Compatibility Chart Transene蚀刻剂/金属兼容表 七.SILICON NITRIDE ETCHING APPARATUS(氮化硅蚀刻仪器) 八.Photoresist Materials(光刻胶,其他译名:光致抗蚀剂\感光性树脂\光阻材料) 1.PKP II Photoresist-Purified Kodak Photoresist精炼柯达光刻胶 2.NPD Negative Resist Developers负性光刻胶显影剂 3.Negative Resist Remover负性光刻胶去除剂 4.Negative Resist Chemicals负性光刻胶化学品 5.Positive Resist Removers正性光刻胶去除剂 6.Photomask Coating-For Use in Photolithography影印石版光掩膜涂料 7.Hexamethyldisilazane (HMDS) 8.ELECTRONICS GRADE PROCESS SOLVENT (电子生产溶剂) 九.Printed Circuit Board Manufacturing Chemicals(印刷电路板制造化学品) 1.Copper Cleaner-For Printed Circuit Boards印刷电路板铜清洗剂 2.COPPER OXIDE REMOVER - COR-100 氧化铜去除剂 3.Bright Electroless Tin 光亮无电镀锡 4.Bright Electroless Gold光亮无电镀金 5.PC Electroless Copper印刷电路板光亮无电镀铜 6.Electroless Nickel Strike-For Copper, Brass and Copper Alloys无电镀镍触击 7.Tin-Lead Plating锡铅电镀 8.Printed Circuit Copper Etchants- CE-100/200印刷电路板铜蚀刻剂 9.Solder Flux焊料助焊剂 10.Silicoat?SILICONE COATING FOR PRINTED CIRCUIT ASSEMBLIES用于印刷电路装配的硅酮涂料 11.Hybrisil?Conformal Coatings for Thin Film/Thick Film薄膜/厚膜保形涂料 12.CONDUCTIVE VIA FILL CVF-6030 13.Radiation Cure Coatings防辐射涂料 十.Semiconductor Materials(半导体材料) Cleaning and Polishing(清洗剂和抛光剂) 1. Waxcut 2. Waxstrip L2X 3. Transene-100 For Ultra Clean Surfaces超清洁表面 4. Transene Ultrasonic Detergent (TUD) 超声波去垢剂 5. Lab Glass Cleaner LGC-300实验室玻璃制品清洁剂 6. Transene Glass Cleaner- 409玻璃制品清洁剂 7. ESP - Electroless Silicon Polish无电镀的硅抛光剂 8. Polimet–Alumina Type Polishing Lapping Preparations氧化铝抛光研磨 9. Polmet - Alumina Type Polishing and Lapping Compounds氧化铝抛光和研磨化合物 10. Sequestrox - Residue Removers for Low K Dielectric and Silicon Devices低K电介质和硅器件残渣去除剂 11. Ultrapure Water超纯水 12. Gold/Silver Cleaner金/银去除剂 13. Tetramethylammonium hydroxide (TMAH)四甲基铵-氢氧化物 Diffusants (扩散剂) Heat Sinks and Vacuum Oil (吸热油脂和真空油) Junction Coatings(结合涂料) 1. SES-Low Viscosity Silicone Elastomer for Semiconductors用于半导体的低粘性硅酮橡胶 2. SES Black-Modified Silicone Elastomer For Light Absorption改良的光吸收硅酮橡胶 3. SSE-Self-Catalyzed Silicone Elastomer自催化硅酮橡胶 4. Translastic S-2007-Silicone Junction Coating For Rectifiers整流器硅酮结合涂料 5. MBS-Moisture Barrier Silicone防潮硅酮 6. Junction Coating Type I Silicone Elastomer Systems for Protection and Passivation of Semiconductor Junctions 用于半导体结合的保护和钝化硅酮橡胶 详细情况请浏览网页：http://blog.sina.com.cn/u/1226366110 |
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