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1. ÏîÄ¿¼ò½é dr weiËùÔÚµÄuniversity of huddersfield¼ÆËãÓ빤³ÌѧԺ£¬ÏÖÃæÏò¹¤³Ìרҵ·½ÏòÕÐÊÕÒ»ÃûÈ«ÈÕÖÆ²©Ê¿£¬Ö÷ÒªÓëÆóÒµºÏ×÷Ó¦ÓÃÓÚµç×ÓÉ¢ÈÈ·½ÃæµÄÎïÀíÄ£ÐͺÍÊý×ÖÂÏÉú¼¼Êõ¡£ Topic: Physics-based Digital Twin for In-Circuit Test Fixture Innovation of High-Power-Density PCB Description: This project introduces hybrid digital twin based on physical simulation and data in the product lifecycle management of in-circuit test (ICT) fixtures. It will deliver a scalable and industry-ready solution to address the technical challenges associated with ICT fixtures, which will significantly improve the reliability high-power-density printed circuit board (PCB) to accelerate new product development used for diverse industrial sectors. In contrast to purely data-centric approaches, the proposed digital twin is grounded in physical laws of mechanics, heat transfer and electronics to model and predict the system operation and degradation mechanisms over time. The twin models will be experimentally calibrated and validated using in-house measurements with enhanced accuracy and long-term predictive capability across the service life of ICT fixtures. To interpret the real-time operational data from the cyber-physical system of ICT, the project will develop a unique solution of integrating high-fidelity Multiphysics simulations with real-time data by internet of things (IoT) under industry 4.0 development. Parametric thermal, mechanical and electrical models will be constructed to capture the critical degradation and failure mechanisms arising from repeated high-current test cycles. These physics-based models will be deployed through reduced-order modelling and machine learning techniques for bidirectional data exchange between the physical fixture and its digital counterpart. It allows the digital twin to update continuously, maintaining an accurate representation of the true operational condition of the service lifecycle of the fixture. Aligned with digital twin operational principles, the proposed system will support continuous verification of fixture performance by a physical prototype development and ensure compliance across cyber¨Cphysical boundaries. The prototype will embed a pilot IoT architecture to monitor the internal running environment incorporating mechanical and electrical parameters. The data from sensors will be interpreted by physical laws and engineering experience to inspire the deviations from safe and compliant operating conditions, supporting predictive maintenance strategies. The framework will address the emerging cyber-physical security considerations, including data integrity, model trustworthiness, and system resilience. The project will establish an iterative loop of physical simulation, site measurement, and model updating, allowing engineers to evaluate what-if scenarios, optimise fixture design and operation, and make robust, data-informed decisions to support high-value production of PCBs in electronics manufacturing. 2. ѧУ¼°»·¾³ university of huddersfieldλÓÚÓ¢¹úÓ¢¸ñÀ¼±±²¿Ò»¸ö°²¾²µÄÓ¢¸ñÀ¼Ð¡Õò£¬½üÆÚÓ¢¹úÎï¼Û·ÉÕÇ£¬Ñ§Ð£ËùÔÚСÕòµÄ×â·¿ºÍÆäËûÏû·Ñ±ÈÒª´ó³ÇÊÐÒª±ãÒ˺ܶà(30% to 50%)¡£Í¬Ê±Ñ§Ð£Î»Öý»Í¨±ãÀû£¬¾àÀëÂü³¹Ë¹ÌØ¡¢Àû×ȵȴó³ÇÊоùÔÚ45·ÖÖӻ𳵳µ³Ì£¬Í¨¹ýÁ½Ëù´ó³ÇÊÐ×ø»ð³µÖ±´ï²®Ã÷º²¡¢Â×¶Ø¡£Ó¢¹úÈ«ÈÕÖÆ²©Ê¿ÆÚÏÞÒ»°ãΪ3.5ÖÁ4Ä꣬²©Ê¿Éú×÷ΪѧУµÄÔ±¹¤¶Ô´ý£¬µ¼Ê¦ºÍѧУ¶¼²»»á¸ø´óµÄѹÁ¦£¬ËùÒÔ¿ÉÒÔ×öµ½¹¤×÷ºÍÉú»îµÄƽºâ£¬²¢ÇÒÓлú»áÈ¥Ç×ÉíÌåÑéÓ¢¹úºÍÅ·ÖÞµÄÎÄ»¯ºÍÉú»î¡£ 3. ÉêÇë ÏîĿԤ¼Æ2027Äê1Ô·ݿªÊ¼£¬ÓÐÐËȤµÄͬѧÐèÔÚ2026Äê10ÔÂ֮ǰÌá½»ÉêÇë¡£¹ú¼ÊѧÉúÐèÒªÌṩÑÅ˼³É¼¨£¬×Ü·Ö²»µÍÓÚ 6.0 (µ¥Ïî²»µÍÓÚ5.5) ¡£ ÉêÇë¾ßÌåÒªÇóºÍ²½Öè¿É²éѯѧУÁ´½Ó£ºhttps://www.hud.ac.uk/postgraduate/research/how-to-apply/ »¶Ó¾ß±¸»úе¡¢ÈÈÄܶ¯Á¦¡¢Á¦Ñ§¡¢²ÄÁÏ¡¢»¯¹¤ÒÔ¼°ÀàËÆÑо¿±³¾°µÄͬѧͨ¹ýÓÊÏäÓ뵼ʦȡµÃÁªÏµ( h.wei@hud.ac.uk)£¬²¢¸½ÉÏÒ»·Ý¸öÈËcv(ѧÊõ¼òÀú)¡£ [ last edited by peterwei on 2026-5-21 at 18:05 ] [ Last edited by peterwei on 2026-5-21 at 18:09 ] |
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