| 查看: 814 | 回复: 3 | |||
| 当前只显示满足指定条件的回帖，点击这里查看本话题的所有回帖 | |||
yusuf1126新虫 (初入文坛)
|
[交流]
CFP： IEEE Consumer Electronics Magazine 已有1人参与
|
||
|
IEEE Consumer Electronics Magazine Special Issue on Advances in Smart Cities Guest Editors: Chai K Toh, NTHU/GLG USA Dejan Milojicic, HP USA Irena Bojanova, NIST USA William Webb, Webb Search, UK XS Hua, ALIBABA CHINA Scope: Consumers work and live in cities around the world. Current cities will gradually be transformed into smart cities with the advancement in AI, data analytics, 5G, IoT, and other new technologies. Smart cities will bring changes to transport, health, living and the environment (green and sustainability), significantly improving the quality of lives of millions of residents. The other aspect of smart cities concerns sustainability and staying green (i.e., lower carbon footprint). Smart cities are expected to last for centuries while consuming resources more efficiently. In this special issue, we will report on smart cities plans, roadmaps, developments, innovations and applications done in the USA (by various cities from different states), progress in smart cities related standards, and also international efforts and field trials done to date. We also welcome detailed comparisons among different smart cities. For this special issue, we seek tutorial-style and review-type papers, along with papers describing design, architectures, accomplished projects and lessons learnt. The topics covered by this special issue will include the following: (a) Smart Transport (b) Smart Living (c) Smart Health (d) Smart Environment (e) Smart Energy (f) Security and safety for Smart Cities (g) System Architectures for Smart Cities (h) Applications for Smart Cities Schedule: Deadline JULY 2020; Outcome September 2020; Publish 4th Quarter 2020 Author Guidelines: Submissions should follow IEEE standard template and should consist of the followings: (i) A manuscript of maximum 6-page length: A pdf of the complete manuscript layout with figures, tables placed within the text, and (ii) Source files: Text should be provided separately from photos and graphics and may be in Word or LaTeX format. High resolution original photos and graphics are required for the final submission. Images embedded in Word or Excel documents are not suitable; however, figures and graphics may be provided in a PowerPoint slide deck, with one figure/graphic per slide. Web URL for the submission of the manuscripts to IEEE-CEM is the following: https://mc.manuscriptcentral.com/cemag. Please select the “Special issue on Advances in Smart Cities” option. IEEE Article templates are available at: https://ieeeauthorcenter.ieee.or ... -article-templates/ Submission enquiries can be sent to: ck_away@hotmail.com |
回复此楼» 猜你喜欢
一志愿北京化工大学材料与化工296分求调剂
已经有12人回复
-
哈工大材料324求调剂
已经有8人回复
-
0857环境调剂
已经有4人回复
-
307求调剂
已经有6人回复
-
材料工程专硕，一志愿中国矿业大学，总分314，求调剂
已经有4人回复
-
化工0817调剂
已经有8人回复
-
材料工程085601调剂求老师收留
已经有8人回复
-
大连大学化学专业研究生调剂
已经有7人回复
-
298求调剂
已经有3人回复
-
320材料与化工，求调剂
已经有14人回复
yusuf1126
新虫 (初入文坛)
- 应助: 0 (幼儿园)
- 金币: 23.6
- 帖子: 17
- 在线: 15.1小时
- 虫号: 19619569
- 注册: 2019-11-06
- 性别: GG
- 专业: 计算机网络
3楼2020-02-04 17:35:48
2楼2020-02-04 10:51:59
 本帖仅楼主可见 |
4楼2020-02-04 18:42:31
