| 查看: 856 | 回复: 3 | |||
yusuf1126新虫 (初入文坛)
|
[交流]
CFP： IEEE Consumer Electronics Magazine 已有1人参与
|
|
IEEE Consumer Electronics Magazine Special Issue on Advances in Smart Cities Guest Editors: Chai K Toh, NTHU/GLG USA Dejan Milojicic, HP USA Irena Bojanova, NIST USA William Webb, Webb Search, UK XS Hua, ALIBABA CHINA Scope: Consumers work and live in cities around the world. Current cities will gradually be transformed into smart cities with the advancement in AI, data analytics, 5G, IoT, and other new technologies. Smart cities will bring changes to transport, health, living and the environment (green and sustainability), significantly improving the quality of lives of millions of residents. The other aspect of smart cities concerns sustainability and staying green (i.e., lower carbon footprint). Smart cities are expected to last for centuries while consuming resources more efficiently. In this special issue, we will report on smart cities plans, roadmaps, developments, innovations and applications done in the USA (by various cities from different states), progress in smart cities related standards, and also international efforts and field trials done to date. We also welcome detailed comparisons among different smart cities. For this special issue, we seek tutorial-style and review-type papers, along with papers describing design, architectures, accomplished projects and lessons learnt. The topics covered by this special issue will include the following: (a) Smart Transport (b) Smart Living (c) Smart Health (d) Smart Environment (e) Smart Energy (f) Security and safety for Smart Cities (g) System Architectures for Smart Cities (h) Applications for Smart Cities Schedule: Deadline JULY 2020; Outcome September 2020; Publish 4th Quarter 2020 Author Guidelines: Submissions should follow IEEE standard template and should consist of the followings: (i) A manuscript of maximum 6-page length: A pdf of the complete manuscript layout with figures, tables placed within the text, and (ii) Source files: Text should be provided separately from photos and graphics and may be in Word or LaTeX format. High resolution original photos and graphics are required for the final submission. Images embedded in Word or Excel documents are not suitable; however, figures and graphics may be provided in a PowerPoint slide deck, with one figure/graphic per slide. Web URL for the submission of the manuscripts to IEEE-CEM is the following: https://mc.manuscriptcentral.com/cemag. Please select the “Special issue on Advances in Smart Cities” option. IEEE Article templates are available at: https://ieeeauthorcenter.ieee.or ... -article-templates/ Submission enquiries can be sent to: ck_away@hotmail.com |
回复此楼» 猜你喜欢
085602调剂 初试总分335
已经有7人回复
-
化学357分，考研调剂
已经有7人回复
-
278求调剂
已经有12人回复
-
085400电子信息319求调剂（接受跨专业调剂）
已经有6人回复
-
323求调剂
已经有7人回复
-
一志愿北京2，材料与化工308求调剂
已经有6人回复
-
26考研调剂0710 0860
已经有13人回复
-
296材料专硕求调剂
已经有22人回复
-
材料调剂
已经有12人回复
-
285求调剂
已经有5人回复
2楼2020-02-04 10:51:59
yusuf1126
新虫 (初入文坛)
- 应助: 0 (幼儿园)
- 金币: 23.6
- 帖子: 17
- 在线: 15.1小时
- 虫号: 19619569
- 注册: 2019-11-06
- 性别: GG
- 专业: 计算机网络
3楼2020-02-04 17:35:48
 本帖仅楼主可见 |
4楼2020-02-04 18:42:31
