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采用循环伏安和计时安培法研究了羟基乙叉二膦酸(HEDPA)镀铜液中铜在玻碳电极上电结晶的初期行为。结果表明：羟基乙叉二膦酸(HEDPA)镀铜体系中，铜的电沉积过程经历了晶核形成过程；当溶液中不含CO32-时，其电结晶按连续三维成核方式进行，而随着CO32-的逐渐加入，使得铜电结晶按瞬时三维成核方式过渡；成核数密度都随着电位的提高而增加。这可能是CO32- -以第二配体形式进入HEDPA和Cu2+构成的络合结构，从而形成更稳定的络合物吸附在电极表面所致。 原来译文如下:The initial stage of copper electrodeposition and the influence of CO32- ions on the nucleation and growth of copper on glass carbon from a 1-hydroxyethylidene-1,1-diphosphonic acid (HEDPA) electrolyte was investigated using cyclic voltammetry (CV) and chronoamperometry (CA) techniques. The nucleation is in a good agreement with the progressive nucleation and three-dimensional (3D) growth for the solutions without CO32-, while instantaneous nucleation with three-dimensional growth was found for the electrolyte with CO32-.There was an increase in the nuclear number density of nuclei at the surface with the increase of potential.The possible explanation for this result was that CO32- could enter the complex to stable the Cu in the structure as the second ligand and formed a kind of more stable complex compound ,which was adsorbed on the surface of electrode. 被期刊要求仔细修改,因此借助网友帮忙了 |
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2楼2009-05-16 17:18:14
3楼2009-05-17 00:46:32
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zhingjw(金币+6,VIP+0):谢谢 5-18 21:52
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我认为翻译不错，不过，was investigated 改成were ,其他的没问题的，至少从语法上没问题，专业词汇因为不太了解，所以觉得应该问题不大，仅供参考。翻译本来就不错，大家没理由说给金币少。如大家还能找到语法错误，就请仁者见仁智者见智了。 The initial stage of copper electrodeposition and the influence of CO32- ions on the nucleation and growth of copper on glass carbon from a 1-hydroxyethylidene-1,1-diphosphonic acid (HEDPA) electrolyte were investigated using cyclic voltammetry (CV) and chronoamperometry (CA) techniques. The nucleation is in a good agreement with the progressive nucleation and three-dimensional (3D) growth for the solutions without CO32-, while instantaneous nucleation with three-dimensional growth was found for the electrolyte with CO32-.There was an increase in the nuclear number density of nuclei at the surface with the increase of potential.The possible explanation for this result was that CO32- could enter the complex to stable the Cu in the structure as the second ligand and formed a kind of more stable complex compound ,which was adsorbed on the surface of electrode. |
4楼2009-05-18 20:06:08
