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silenceLee

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[交流] 【Ei/ISTP双收录】第8届机电一体化、控制与材料国际会议

2017 8th International Conference on Mechatronics, Control and Materials (ICMCM 2017) will be held in Yinchuan, China, on August 12-13, 2017.

第8届机电一体化、控制与材料国际会议将于8月12-13在银川举行

会议官网https://www.csetis.hk/ICMCM2017

All accepted papers will be published by "Advances in Engineering Research(ISSN 2352-5401)", and will be submitted to the major academic databases, including Ei-Compendex(www.ei.org), Google and Google Scholar (www.google.com), ISI (ISTP, CPCI, Web of Science,www.isinet.com) and other indexing services.

Selected excellent papers will be published on EI journals and SCI-Indexed journals.

主题方向:
Topic 1: Mechatronics  机电一体化、机械
Theory of Mechanisms and Mechanical Dynamics
Design and Control in Modern mechantronics System Engineering
Structural Engineering Analysis, CAD Optimized Design and Intelligent Control
Micro-electromechanical Systems
Transmission and Simulation Technology
Robotics and its Motor System
Sensor and Actuator Technology
Intelligent Systems Group Communication and Coordination
Bionic Technology
Voice Processing
Image and Video Processing
Signal Processing Systems Design and Implementation
Computer Information Processing Technology
Artificial Intelligence Techniques
Neural Network Technology
Multi-sensor Information Fusion Technology
Infrastructure and Technology in Industrial Informatics
Cognitive and Computational Intelligence in Industrial Informatics
Factory Automation and Industrial Informatics
Industrial Informatics Applications
New Paradigms in Industrial Informatics
Tools for Industrial Informatics
Control System Modeling and Simulation technology
Intelligent Optimization Agorithms and Applications
Fluid Power Transmission and Control
Production Process Simulation
Industrial Robotics and Automation
Electric Automation
Vehicle Control Systems
Intelligent Traffic Control
Computer Integrated Manufacturing
Microelectronics Technology
Embedded Systems

Topic 2: Control  控制
Adaptive Control
Automated Guided Vehicles
Biomedical Engineering and Biosystems Automation
Control Education
Control Theory and Application
Discrete Event Systems
Electronic Commerce and Office Automation
Estimation and Identification
Factory Modeling and Automation
Fault Detection
Flexible Manufacturing Systems
Fuzzy and Neural Systems
Industrial Process Control
Instruments and Vibration Control
Integrated Manufacturing
Intelligent and AI Based Control
Intelligent Automation
Learning Systems
Linear Systems
Man-machine Interactions
Manufacturing Control and Automation Engineering
Material Processing and Control
Modeling of Complex Systems
Motion Control
Multi-agent systems
Network Intelligence and Network Control
Nonlinear Systems and Control
Optimal Control
Petri-Nets and Applications Petri-
Process Automation
Process Control & Instrumentation
Real-time Systems
Robotics
Robust and Control
Sensor networks and networked control
Sensor/data fusion
Smart Structures

Topic 3:Materials  材料
Electronic Materials and Applications
Laser Materials, Fabrication and Characterization
Materials behavior
Casting and solidification
Biobased Materials
Biobased Composites and Nanocomposites
Powder metallurgy and ceramic forming
Electronic packaging technology and materials
Smart materials and structures
Electronic materials and embedded software
Surface, subsurface, and interface phenomena
Coatings and surface engineering
Composite materials
Materials forming
Energy Conversion and Storage Materials
Nanomaterials
Composites and polymer materials
Biomaterials
Semi-conductor and micro-electronic materials
Smart/Intelligent Materials/Intelligent Systems
Thin Films
New Functional Materials
Metal alloy materials
Iron and Steel
Building Materials
Coatings and surface engineering
Materials Characterization
Mechanical Behavior & Fracture
Testing and Evaluation of Materials


Important Dates

截止日期7月28日
召开日期8月12-13日


往届已全部检索
会议官网: https://www.csetis.hk/ICMCM2017
投稿邮箱:icmcm2017@163.com(投稿备注“高老师推荐”)

投稿说明:
1. 本会议官方语言为英语,只接受英文论文,投稿者务必用英语撰写论文。稿件应为原创作品,未在国内外刊物上发表过, 不接受一稿多投。
2. 请根据格式模板文件编辑您的文章。
3. 稿件内容要求不涉及机密、署名无争议,严禁抄袭行为。如发生法律或经济纠纷由投稿人承担相应责任。

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silenceLee(金币+1): 谢谢参与
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