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【Ei/ISTP双收录】第8届机电一体化、控制与材料国际会议
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2017 8th International Conference on Mechatronics, Control and Materials (ICMCM 2017) will be held in Yinchuan, China, on August 12-13, 2017. 第8届机电一体化、控制与材料国际会议将于8月12-13在银川举行 会议官网https://www.csetis.hk/ICMCM2017 All accepted papers will be published by "Advances in Engineering Research(ISSN 2352-5401)", and will be submitted to the major academic databases, including Ei-Compendex(www.ei.org), Google and Google Scholar (www.google.com), ISI (ISTP, CPCI, Web of Science,www.isinet.com) and other indexing services. Selected excellent papers will be published on EI journals and SCI-Indexed journals. 主题方向： Topic 1: Mechatronics 机电一体化、机械 Theory of Mechanisms and Mechanical Dynamics Design and Control in Modern mechantronics System Engineering Structural Engineering Analysis, CAD Optimized Design and Intelligent Control Micro-electromechanical Systems Transmission and Simulation Technology Robotics and its Motor System Sensor and Actuator Technology Intelligent Systems Group Communication and Coordination Bionic Technology Voice Processing Image and Video Processing Signal Processing Systems Design and Implementation Computer Information Processing Technology Artificial Intelligence Techniques Neural Network Technology Multi-sensor Information Fusion Technology Infrastructure and Technology in Industrial Informatics Cognitive and Computational Intelligence in Industrial Informatics Factory Automation and Industrial Informatics Industrial Informatics Applications New Paradigms in Industrial Informatics Tools for Industrial Informatics Control System Modeling and Simulation technology Intelligent Optimization Agorithms and Applications Fluid Power Transmission and Control Production Process Simulation Industrial Robotics and Automation Electric Automation Vehicle Control Systems Intelligent Traffic Control Computer Integrated Manufacturing Microelectronics Technology Embedded Systems Topic 2: Control 控制 Adaptive Control Automated Guided Vehicles Biomedical Engineering and Biosystems Automation Control Education Control Theory and Application Discrete Event Systems Electronic Commerce and Office Automation Estimation and Identification Factory Modeling and Automation Fault Detection Flexible Manufacturing Systems Fuzzy and Neural Systems Industrial Process Control Instruments and Vibration Control Integrated Manufacturing Intelligent and AI Based Control Intelligent Automation Learning Systems Linear Systems Man-machine Interactions Manufacturing Control and Automation Engineering Material Processing and Control Modeling of Complex Systems Motion Control Multi-agent systems Network Intelligence and Network Control Nonlinear Systems and Control Optimal Control Petri-Nets and Applications Petri- Process Automation Process Control & Instrumentation Real-time Systems Robotics Robust and Control Sensor networks and networked control Sensor/data fusion Smart Structures Topic 3：Materials 材料 Electronic Materials and Applications Laser Materials, Fabrication and Characterization Materials behavior Casting and solidification Biobased Materials Biobased Composites and Nanocomposites Powder metallurgy and ceramic forming Electronic packaging technology and materials Smart materials and structures Electronic materials and embedded software Surface, subsurface, and interface phenomena Coatings and surface engineering Composite materials Materials forming Energy Conversion and Storage Materials Nanomaterials Composites and polymer materials Biomaterials Semi-conductor and micro-electronic materials Smart/Intelligent Materials/Intelligent Systems Thin Films New Functional Materials Metal alloy materials Iron and Steel Building Materials Coatings and surface engineering Materials Characterization Mechanical Behavior & Fracture Testing and Evaluation of Materials Important Dates 截止日期7月28日 召开日期8月12-13日 往届已全部检索 会议官网: https://www.csetis.hk/ICMCM2017 投稿邮箱:icmcm2017@163.com（投稿备注“高老师推荐”） 投稿说明： 1. 本会议官方语言为英语，只接受英文论文，投稿者务必用英语撰写论文。稿件应为原创作品，未在国内外刊物上发表过, 不接受一稿多投。 2. 请根据格式模板文件编辑您的文章。 3. 稿件内容要求不涉及机密、署名无争议，严禁抄袭行为。如发生法律或经济纠纷由投稿人承担相应责任。 |
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