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【2009-01-31】empc2009第17届欧洲微电子封装会议及展览
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17th EUROPEAN MICROELECTRONICS and PACKAGING CONFERENCE & EXHIBITION EMPC 2009 June 15th -18th, 2009 - Rimini - Italy www.empc2009.org CALL FOR PAPERS Deadline for submission: January 31st 2009 STEERING COMMITTEE Chair: Roberto May Co-chair: Tino Taddei, Giovanni Delrosso Treasurer: Antonello Ciappesoni Technical programme: Carlo Cognetti, Roberto Dell’Acqua Professional Development Courses: Alessandro Gandelli Exhibition: Luigi Calligarich Marketing: Janmario Reina 17th EUROPEAN MICROELECTRONICS and PACKAGING CONFERENCE & EXHIBITION EMPC 2009 June 15th -18th, 2009 - Rimini - Italy www.empc2009.org CALL FOR PAPERS Deadline for submission: December 31st 2008 The aim of IMAPS is to take to Rimini, one of the most renowned bathing resort towns in Italy, the best of Microelectronics and Packaging, thus offering a top quality coverage of technological innovation related to microelectronic packaging and interconnection technologies. The four day Conference and Exhibition will be held from 15th to 18th June 2009 at Palacongressi in Rimini. It will be complemented by Advanced Professional Courses and by poster sessions. You are cordially invited to submit a paper on Microelectronics Technologies, for oral or poster presentation at the Conference, on the following topics: ADVANCED PACKAGING: - Single Chip and Multi Chip Packaging, Wafer Level Packaging, 3D-WLP, 3D-IC, SIP, SOP and other System Integration Technologies; - Embedded Passives on Wafers and Substrates; - High Frequency and High Power Packaging; - LTCC Ceramics Technologies; - PCB and BGA Substrates Design and Technologies, Laminates, Micro-Vias and Build-Up Technologies, Flex, MID. INTERCONNECTION TECHNOLOGIES: - Thick and Thin Film Technologies; - Wire Bonding, Bumping, Flip Chip Bonding; - Cu/Low-k Wafers, Through Silicon Vias; - Lead-Free Soldering and Adhesive Joining. MORE THAN MOORE: - MEMS Packaging: MEMS Based Sensors and Actuators Packaging, RF-MEMS, Optical MEMS and Bio- MEMS; - Optoelectronics: Power LED Packaging and Light Guiding, Packaging of Optoelectronic Modules suitable for Gb/s Fiber Optic Communication; - Solar Energy (Photovoltaics): Packaging Design to improve Efficiency of Photovoltaic modules Reliability and Qualification Approaches; - Nano Technologies: Smart Materials, Interconnections, Nano-Scale Packaging; - Medical Electronics: Applications, Design, Development, Manufacturing that comply with complex and demanding regulations and market requirements. POWER ELECTRONICS: Application in Consumer, Telecom, Automotive, Wearable, Space and Defence. MANUFACTURING TECHNOLOGIES AND MATERIALS: - Process Development, New Equipment, Yield Improvement, Cost and Cycle Time Reduction, Green Manufacturing; - Adhesives, Encapsulants, Underfills, Moulding Compounds, Lead-Free Solder Alloys, Halogen Free Materials, Dielectrics and Ceramics. MODELLING - Electrical Modelling and Signal Integrity: Time and Frequency Domain Analysis of Interconnection and Packaging Technologies; - Thermal Characterisation and Cooling Solutions: Modelling and Simulation Methodology for Characterisation of Advanced Packaging, Modules and Systems, Novel Cooling Techniques; - Mechanical Modelling and Structural Integrity: Thermo-Mechanical Stress Analysis, Vibration and Shock Tests; - Quality and Reliability: Component, Board and System Level Reliability Assessment, Failure Analysis, Interfacial Adhesion and Accelerated Testing Methods.Sample Text [ Last edited by 努力着 on 2009-1-15 at 10:50 ] |
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