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[交流] 【2009-01-31】empc2009第17届欧洲微电子封装会议及展览

17th EUROPEAN MICROELECTRONICS and PACKAGING
CONFERENCE & EXHIBITION
EMPC 2009
June 15th -18th, 2009 - Rimini - Italy
www.empc2009.org

CALL FOR PAPERS
Deadline for submission: January 31st 2009

STEERING COMMITTEE
Chair:
Roberto May
Co-chair:
Tino Taddei,
Giovanni Delrosso
Treasurer:
Antonello Ciappesoni
Technical programme:
Carlo Cognetti,
Roberto Dell’Acqua
Professional Development
Courses:
Alessandro Gandelli
Exhibition:
Luigi Calligarich
Marketing:
Janmario Reina
17th EUROPEAN MICROELECTRONICS and PACKAGING
CONFERENCE & EXHIBITION
EMPC 2009
June 15th -18th, 2009 - Rimini - Italy
www.empc2009.org
CALL FOR PAPERS
Deadline for submission: December 31st 2008
The aim of IMAPS is to take to Rimini, one of the most renowned bathing resort towns in Italy, the best of
Microelectronics and Packaging, thus offering a top quality coverage of technological innovation related to
microelectronic packaging and interconnection technologies. The four day Conference and Exhibition will
be held from 15th to 18th June 2009 at Palacongressi in Rimini. It will be complemented by Advanced
Professional Courses and by poster sessions.
You are cordially invited to submit a paper on Microelectronics Technologies, for oral or poster presentation
at the Conference, on the following topics:
ADVANCED PACKAGING:
- Single Chip and Multi Chip Packaging, Wafer Level Packaging, 3D-WLP, 3D-IC, SIP, SOP and other
System Integration Technologies;
- Embedded Passives on Wafers and Substrates;
- High Frequency and High Power Packaging;
- LTCC Ceramics Technologies;
- PCB and BGA Substrates Design and Technologies, Laminates, Micro-Vias and Build-Up Technologies,
Flex, MID.
INTERCONNECTION TECHNOLOGIES:
- Thick and Thin Film Technologies;
- Wire Bonding, Bumping, Flip Chip Bonding;
- Cu/Low-k Wafers, Through Silicon Vias;
- Lead-Free Soldering and Adhesive Joining.
MORE THAN MOORE:
- MEMS Packaging: MEMS Based Sensors and Actuators Packaging, RF-MEMS, Optical MEMS and Bio-
MEMS;
- Optoelectronics: Power LED Packaging and Light Guiding, Packaging of Optoelectronic Modules suitable
for Gb/s Fiber Optic Communication;
- Solar Energy (Photovoltaics): Packaging Design to improve Efficiency of Photovoltaic modules
Reliability and Qualification Approaches;
- Nano Technologies: Smart Materials, Interconnections, Nano-Scale Packaging;
- Medical Electronics: Applications, Design, Development, Manufacturing that comply with complex
and demanding regulations and market requirements.
POWER ELECTRONICS:
Application in Consumer, Telecom, Automotive, Wearable, Space and Defence.
MANUFACTURING TECHNOLOGIES AND MATERIALS:
- Process Development, New Equipment, Yield Improvement, Cost and Cycle Time Reduction, Green
Manufacturing;
- Adhesives, Encapsulants, Underfills, Moulding Compounds, Lead-Free Solder Alloys, Halogen Free
Materials, Dielectrics and Ceramics.
MODELLING
- Electrical Modelling and Signal Integrity: Time and Frequency Domain Analysis of Interconnection
and Packaging Technologies;
- Thermal Characterisation and Cooling Solutions: Modelling and Simulation Methodology for
Characterisation of Advanced Packaging, Modules and Systems, Novel Cooling Techniques;
- Mechanical Modelling and Structural Integrity: Thermo-Mechanical Stress Analysis, Vibration and
Shock Tests;
- Quality and Reliability: Component, Board and System Level Reliability Assessment, Failure Analysis,
Interfacial Adhesion and Accelerated Testing Methods.Sample Text

[ Last edited by 努力着 on 2009-1-15 at 10:50 ]

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