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[交流] Int.Conf. on Smart Materials and Nanotechnology in Engineering (SMN2009)

Dear Colleagues,

International Conference on Smart Materials and Nanotechnology in Engineering (SMN2007) was held successfully in Harbin, China. All papers in SMN2007 conference proceedings published by SPIE have been indexed by Web of Science, Ei Compendex. 2nd International Conference on Smart Materials and Nanotechnology in Engineering (SMN2009) will be held in Weihai, China. Abstract submission system on-line is opened. Welcome you to submit your papers and attend the conference.



*****2nd International Conference on Smart Materials and Nanotechnology in Engineering*****
8-11 July 2009, Weihai, P. R. China
http://smart-nano.org/smn2009


==Important Dates==

Deadline of abstract submission:  15th January, 2009

Date of abstract acceptance:  18th March, 2009

Deadline of pre-registration:  1st June, 2009

Deadline of final paper:  8th July, 2009



==Plenary Speakers==

Fu-Kuo Chang     Stanford University  USA

Ken P. Chong     National Science Foundation (NSF)  USA

Yoseph Bar-Cohen        Jet Propulsion Lab.(JPL) NASA  USA

Ephrahim Garcia      Cornell University  USA

Donald J. Leo      Virginia Polytechnic Institute and State University  USA

Zhigang Suo      Harvard University  USA

Holger Speckmann      AIRBUS Deutschland Gmbh  Germany


==Publications==
The conference proceedings will be published by SPIE, and published digitally in SPIE's digital library, which widely indexed by INSPEC, Ei Compendex, Physics Abstracts, Chemical Abstracts, SPIN, International Aerospace Abstracts, ISI Index to Scientific and Technical Proceedings, and the Smithsonian/NASA Astrophysics Data System Abstract Service (ADS). After normal peer-review process, selected full-length papers will be published in the special issues of SCI cited journals.



==Submission==

Deadline of abstract submission : 15th January, 2009

All abstracts must be submitted on-line via http://smart-nano.org/smn2009.
All manuscripts must be submitted on-line via MySPIE (http://myspie.org/submission/ind ... mp;EventId=871601).

The followings are expected: title of proposed paper; name of author(s), corresponding author should be indicated; author’s affiliation; abstract (200-300 words); not more than 6 keywords.


==Registration==

Before 1st May, 2009
US $500 per person for author delegate and US $150 for spouse
US $300 per person for student delegate
After 1st May, 2009
US $550 per person for author delegate and US $200 for spouse
US $350 per person for student delegate
The registration fee covers:
Proceeding, reception, banquet, coffee breaks, lunches, dinners.



==Organized by==
Harbin Institute of Technology, China

==Cooperating Organization==

SPIE, USA

National Science Foundation (NSF), USA

Asia Pacific Committee of Smart and Nano Materials (APCSNM)

Advanced Materials Research Centre, College of Engineering, Nanyang Technological University, Singapore

The National Natural Science Foundation of China (NSFC)

Chinese Society of Composite Materials

Chinese Society of Mechanics

Chinese Society of Aeronautics and Astronautics

Chinese Society of Theoretical and Applied Mechanics

Chinese Materials Research Society (C-MRS)

American Society of Civil Engineers


We are looking forward to seeing you at the conference.

Yours sincerely,

Prof. Jinsong Leng, Conference Chair

Harbin Institute of Technology, P. R. China

Address: PO Box 3011, No.2 Yikuang Street,

Centre for Composite Materials and Structures,

Science Park of Harbin Institute of Technology,

Harbin 150080, P. R. China

Email: lengjs@hit.edu.cn

Tel/Fax: 86-451-86402328

Prof. Anand Asundi, Conference Co-Chair

School of Mechanical and Aerospace Engg. Nanyang Technological University, Singapore

Email: anand.asundi@pmail.ntu.edu.sg

Dr. Wolfgang Ecke, Conference Co-Chair

Institute for Physical High Technology, Jena  Germany

Email: ecke@ipht-jena.de
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